New robust small radius joints based on thermal shrinkage of polyimide in V-grooves

Ebefors, Thorbjörn; Kälvesten, Edvard; Vieider, C.; Stemme, Göran

doi:10.1109/sensor.1997.613742

Cited by 11 publications

(13 citation statements)

References 6 publications

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“…[ 17 ] Copyright 1999. f) The silicon‐based microbot walking, holding a load of 2500 mg. Reproduced (adapted) with permission. [ 17 ] Copyright 1999. g) The thermo‐mechanically actuated silicon‐based microbot. Reproduced (adapted) with permission.…”

Section: Thermal Actuatorsmentioning

confidence: 99%

“…[ 3,4,8,11,13 ] Additional interesting applications of microbotics include the picking and placing of micro‐sized objects, [ 14–16 ] micro‐assembly, [ 4,17,18 ] and micro‐manipulation. [ 4,16,18,19 ] Microbots have also attracted significant attention in the field of biomedical engineering, [ 20 ] where they have been employed in vivo for treatments, [ 21,22 ] drug delivery, [ 22–25 ] during noninvasive micro‐surgeries [ 17,19,22–24 ] to deliver cargo such as stem cells, and to sample tissues in inaccessible locations. [ 23,24,26,27 ]…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Actuation of Mobile Microbots: A Review

Hussein,

Damdam,

Ren

et al. 2023

Advanced Intelligent Systems

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Maturation of robotics research and advances in the miniaturization of machines have contributed to the development of microbots and enabled new technological possibilities and applications. Microbots have a wide range of applications, including the navigation of confined spaces, environmental monitoring, micro‐assembly and manipulation of small objects, and in vivo micro‐surgeries and drug delivery. Actuators are among the most critical components that define the performance of robots. A comprehensive review of the actuation mechanisms that have been employed in mobile microbots is provided, including piezoelectric, magnetic, electrostatic, thermal, acoustic, biological, chemical, and optical actuation, with a focus on the most recent development and methodologies.

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Section: Thermal Actuatorsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Actuation of Mobile Microbots: A Review

Hussein,

Damdam,

Ren

et al. 2023

Advanced Intelligent Systems

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show abstract

“…In recent years, research on insect-scale microrobots has attracted much attention. Various types of robots, such as walking robots [1] , swimming robots [2] , and flying vehicles [3] , have been studied. At very small scales, a significant amount of energy is lost due to friction in rotating mechanisms.…”

Section: Introductionmentioning

confidence: 99%

Hot lamination and origami assembly fabrication of miniaturized compliant mechanism

Ozaki¹,

Ohta²,

Fujiyoshi³

2021

MethodsX

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We developed a process for fabricating a miniaturized hinged mechanism for microrobots by customizing our previously reported flapping-wing method to fabricate microscopic wing structures resembling insects. Flexible hinges were realized by removing the titanium layers of the structure, which were previously sandwiched between thin polyimide layers. A three-dimensional structure can also be realized via origami-like assembly owing to the hinge structure, where the hinge is made to work as a crease. Details of our method and a reference design are reported through a demonstration of a translation-to-rotation conversion mechanism for a piezoelectric actuator. • Simple fabrication using a single hot lamination and origami-like assembly. • Method based on FPC manufacturing technologies would be easy to implement in a variety of research. • Transmission mechanism for piezoelectric actuators was demonstrated, verifying that the structures fabricated by this process function appropriately.

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“…In addition, contact-based methods pose challenges in the assembly of fragile micro-components, unlike contactless methods, which are by nature more compatible with fragile devices. Different principles have been explored to address the contactless out-of-plane in-situ manipulation of planar structures attached to a substrate, including magnetically induced bending [1][2][3][4]14,15 , bimorph-based bending by differential internal stress 16,17 or thermal stress 18,19 , surface tension-driven assembly [20][21][22] , and other more complex approaches 8,23 . However, most of these techniques are not versatile methods to assemble microchips in a separately fabricated receiving substrate, which might be needed in, e.g., sensing applications 5 .…”

Section: Introductionmentioning

confidence: 99%

Vertical integration of microchips by magnetic assembly and edge wire bonding

et al. 2020

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The out-of-plane integration of microfabricated planar microchips into functional three-dimensional (3D) devices is a challenge in various emerging MEMS applications such as advanced biosensors and flow sensors. However, no conventional approach currently provides a versatile solution to vertically assemble sensitive or fragile microchips into a separate receiving substrate and to create electrical connections. In this study, we present a method to realize vertical magnetic-field-assisted assembly of discrete silicon microchips into a target receiving substrate and subsequent electrical contacting of the microchips by edge wire bonding, to create interconnections between the receiving substrate and the vertically oriented microchips. Vertical assembly is achieved by combining carefully designed microchip geometries for shape matching and striped patterns of the ferromagnetic material (nickel) on the backside of the microchips, enabling controlled vertical lifting directionality independently of the microchip's aspect ratio. To form electrical connections between the receiving substrate and a vertically assembled microchip, featuring standard metallic contact electrodes only on its frontside, an edge wire bonding process was developed to realize ball bonds on the top sidewall of the vertically placed microchip. The top sidewall features silicon trenches in correspondence to the frontside electrodes, which induce deformation of the free air balls and result in both mechanical ball bond fixation and around-the-edge metallic connections. The edge wire bonds are realized at room temperature and show minimal contact resistance (<0.2 Ω) and excellent mechanical robustness (>168 mN in pull tests). In our approach, the microchips and the receiving substrate are independently manufactured using standard silicon micromachining processes and materials, with a subsequent heterogeneous integration of the components. Thus, this integration technology potentially enables emerging MEMS applications that require 3D out-of-plane assembly of microchips.

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New robust small radius joints based on thermal shrinkage of polyimide in V-grooves

Cited by 11 publications

References 6 publications

Actuation of Mobile Microbots: A Review

Actuation of Mobile Microbots: A Review

Hot lamination and origami assembly fabrication of miniaturized compliant mechanism

Vertical integration of microchips by magnetic assembly and edge wire bonding

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