2011
DOI: 10.1016/j.matchemphys.2010.12.039
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New photosensitive colorless polyimide-silica hybrid optical materials: Synthesis, properties and patterning

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Cited by 30 publications
(13 citation statements)
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“…Nowadays, blending polymer composites with inorganic materials has become a prevalent topic in material science because of the suitable properties from both inorganic components (heat resistance, retention of mechanical properties at high temperatures, and good dielectric properties) and organic polymers (toughness, ductility, and processability). [1][2][3][4][5] Being an important class of high-performance polymers, polyimides (PIs) are widely used in the preparation of hybrids owing to their excellent thermal stability, superior mechanical properties, high glass transition temperature (T g ), high volume resistivity, radiation, and chemical resistance. 6,7 These properties make PIs widely applicable in the production of electronic, fiber, adhesive, and film material.…”
Section: Introductionmentioning
confidence: 99%
“…Nowadays, blending polymer composites with inorganic materials has become a prevalent topic in material science because of the suitable properties from both inorganic components (heat resistance, retention of mechanical properties at high temperatures, and good dielectric properties) and organic polymers (toughness, ductility, and processability). [1][2][3][4][5] Being an important class of high-performance polymers, polyimides (PIs) are widely used in the preparation of hybrids owing to their excellent thermal stability, superior mechanical properties, high glass transition temperature (T g ), high volume resistivity, radiation, and chemical resistance. 6,7 These properties make PIs widely applicable in the production of electronic, fiber, adhesive, and film material.…”
Section: Introductionmentioning
confidence: 99%
“…Nowadays, polymer-inorganic hybrid materials become a popular topic in material science because they inherit the suitable properties from both inorganic component (heat resistance, retention of mechanical properties at high temperatures, and low thermal expansion) and those of organic polymer (toughness, ductility, and processability) [1][2][3][4][5]. Polyimides (PIs) as high-performance organic matrix are used in the preparation of hybrids due to having excellent thermal stability with respect to decomposition, good mechanical properties, chemical stability against oxidation, and low dielectric constant.…”
Section: Introductionmentioning
confidence: 99%
“…2,3 Although they are well recognized as a class of thermally stable engineering polymers, they generally have been hard to process due to their infusibility and poor solubility in organic solvents. To overcome these difficulties, several approaches have been investigated in an attempt to improve the solubility of PIs, and the most important of them are the preparation of copolymers such as poly(amide-imide)s (PAIs) and poly(amide-ester-imide)s. [4][5][6][7][8][9][10][11][12] PAIs are the compounds with bulky groups into the polymer backbone or bulky pendant groups seem to be a good balance between thermostability and processability. PAIs are thermally stable and processable compounds which have attracted great attention in the recent past decades, due to their exclusive combination of toughness, lightness, and dimensional stability at high temperatures.…”
Section: Introductionmentioning
confidence: 99%