“…Nowadays, blending polymer composites with inorganic materials has become a prevalent topic in material science because of the suitable properties from both inorganic components (heat resistance, retention of mechanical properties at high temperatures, and good dielectric properties) and organic polymers (toughness, ductility, and processability). [1][2][3][4][5] Being an important class of high-performance polymers, polyimides (PIs) are widely used in the preparation of hybrids owing to their excellent thermal stability, superior mechanical properties, high glass transition temperature (T g ), high volume resistivity, radiation, and chemical resistance. 6,7 These properties make PIs widely applicable in the production of electronic, fiber, adhesive, and film material.…”