New Pb-free solder alloy with superior mechanical properties

McCormack, M.; Jin, S.; Kammlott, G. W.; Chen, H. S.

doi:10.1063/1.109734

Cited by 179 publications

(79 citation statements)

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“…However, the microstructure with the Znrich phase, the AgZn 3 compound and the Al segregation were so uniformly distributed that the average values of the UTS and yield stress in the 0.45Al-containing alloy increase. 38) The tensile strain was obviously decreased because stress concentration occurred at the interface between the compound or segregation and the matrix.…”

Section: Variation In Mechanical Propertiesmentioning

confidence: 99%

Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys

Cheng

Lin

2005

Mater. Trans.

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The microstructure and mechanical properties of as cast lead-free solders including eutectic Sn-9Zn, Sn-8.55Zn-1Ag and Sn-8.55Zn-1Ag-XAl (X ¼ 0:01$0:45 mass%) alloys were investigated. Microstructures of the Sn-Zn-Ag-XAl alloys consist of AgZn 3 compound, Zn-rich phase, Al-rich segregation and hypoeutectic phase. The addition of Al dramatically improves the 0.2% offset yield stress, Vickers hardness, ultimate tensile stress (UTS) and total tensile strain of the Sn-8.55Zn-1Ag-XAl alloys. The increase in the Al content of the Sn-8.55Zn-1Ag-XAl alloy from 0.01 to 0.45 mass% increases the average yield stress from 49.9 to 54.0 MPa ($47:6 MPa for eutectic Sn-9Zn) and the Vickers hardness from 17.0 to 18.3 Hv ($16:8 Hv for eutectic Sn-9Zn). The average values of UTS of the Sn-8.55Zn-1Ag-XAl alloys with X ¼ 0:01, 0.1, 0.25 and 0.45 mass% Al are 55, 58, 55 and 60 MPa, respectively, while those of the tensile strain are 47%, 52%, 58% and 45%, respectively (52 MPa and 50% for the eutectic Sn-9Zn alloy). Fracture mechanisms of the Sn-8.55Zn-1Ag-XAl alloys are correlated with the Zn-rich phase and Al segregation.

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Section: Variation In Mechanical Propertiesmentioning

confidence: 99%

Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys

Cheng

Lin

2005

Mater. Trans.

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“…[1][2][3] Sn-Ag and Sn-Ag-Cu alloys are expected to be the lead-free alternatives on the reflow soldering process, because they have better mechanical properties like ductility, creep resistance and thermal resistance than the Sn-Pb solder. 4) However the melting point for them is higher and the wettability is poorer than the Sn-Pb solder. On the other hand, Sn-Cu alloys are expected to be an indispensable leadfree alternative to the wave soldering process.…”

Section: Introductionmentioning

confidence: 99%

Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders

et al. 2005

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The low-cycle fatigue behavior of Sn-3.5 mass%Ag, Sn-0.7 mass%Cu lead-free solders and Sn-37 mass%Pb solder were investigated at a strain rate of 0.1%/s with a non-contact extensometer at room temperature (22 AE 3 C). In addition, the relationship between the surface features in the low-cycle fatigue test and the fatigue life of those solders were investigated by image processing. The fatigue lives of Sn-3.5 mass%Ag and Sn-0.7 mass%Cu were better than that of Sn-37 mass%Pb. The low-cycle fatigue behavior on each solder followed Coffin-Manson equation. The surface deformation in fine wrinkles was observed in the low-cycle fatigue test at each solder. The surface features for each solder were evaluated by image processing from the surface deformation. The surface features in the low-cycle fatigue test did not appear until under 10% of the fatigue life for Sn-3.5 mass%Ag, until 10% of the fatigue life for Sn-0.7 mass%Cu, and until 20% of the fatigue life for Sn-37 mass%Pb.

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“…However, ternaries (SnAgCu, SnZnAg, SnZnIn, etc.) and even quaternary alloys (SnZnAgAl, SnAgBiCu, SnInAgSb) had also been studied as candidates for lead-free solders [2][3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

Medgyes

Illés

Harsányi

2013

Per. Pol. Elec. Eng.

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The reliability investigation of lead-free solders is still a current issue. In this paper, Electrochemical Migration (ECM) behaviour of novel lead-free micro-alloyed low Ag content solders was investigated by water drop test in IntroductionIn microelectronics industry, the applied solder materials are one of the most important factors related to the reliability of the products. According to the Restrictions of Hazardous Substances (RoHS) directive of European Union, lead bearing solders had to be replaced with lead-free ones [1]. In this context, alternative binary alloys had been examined as replacements for SnPb solders, such as near-eutectic SnAg, SnCu and SnZn alloys. However, ternaries (SnAgCu, SnZnAg, SnZnIn, etc.) and even quaternary alloys (SnZnAgAl, SnAgBiCu, SnInAgSb) had also been studied as candidates for lead-free solders [2][3][4][5][6][7].The reliability investigation of lead-free solders is still a current issue. One of the important reliability topics is the electrochemical migration (ECM) failure phenomenon. The common characteristics of the ECM phenomenon include the presence of moisture on conductor-dielectric-conductor systems under bias voltage, the electrochemical process and the metallic dendrite growth. This process is driven by the applied electric field from the anode to the cathode. Dendrite growth occurs as a result of metal ions being dissolved into a solution from the anode and deposited at the cathode, thereby growing in needle or tree-like formations. This effect causes short-circuits in electronic circuits, which may lead to a catastrophic failure.Many papers can be found about ECM investigations carried out on different lead-free solder alloys. Takemoto et al. have found that some tin based lead-free solder alloys are more resistant to ECM than Sn-Pb40 alloy and pure Indium. In-48Sn and In-50Pb alloys were found to be immune to ECM in high purity water [8]. Yu et al. have described that in Sn-37Pb and Sn-36Pb2Ag systems the main migration element is Pb, while in Sn-Ag and Sn-Ag-Cu solder alloys Sn leads the migration in high purity water [9,10].Other publication reported that SAC305 lead-free solder alloy has longer ECM lifetime in 0.001% NaCl solution than in 0.001% Na2SO4, since the passivity layer formed of SnO2 is thicker in the case of NaCl solution and Sn is the only element that contributes to ECM at room temperature [11]. The migration behaviour and the deposition process of Sn, Cu and Ag in case of SAC305 solder alloy were also observed in a thermal-

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New Pb-free solder alloy with superior mechanical properties

Cited by 179 publications

References 1 publication

Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys

Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys

Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

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New Pb-free solder alloy with superior mechanical properties

Cited by 179 publications

References 1 publication

Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys

Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys

Fatigue Damage Evaluation by Surface Feature for Sn&ndash;3.5Ag and Sn&ndash;0.7Cu Solders

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

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Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders