1993
DOI: 10.1016/0167-9317(93)90163-y
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New model of a common origin for trapped holes and anomalous positive charge in MOS capacitors

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Cited by 28 publications
(13 citation statements)
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“…Figure 8͑c͒ shows that the generation under 77 K is substantially reduced now. This result supports the early works, 5,14,34 which showed that hydrogen could play a major role in positive charge formation when their density was sufficiently high. For a given level of electron injection, the amount of injected holes should be insensitive to temperature, either.…”
Section: Effects Of Hydrogen At Room Temperaturesupporting
confidence: 91%
“…Figure 8͑c͒ shows that the generation under 77 K is substantially reduced now. This result supports the early works, 5,14,34 which showed that hydrogen could play a major role in positive charge formation when their density was sufficiently high. For a given level of electron injection, the amount of injected holes should be insensitive to temperature, either.…”
Section: Effects Of Hydrogen At Room Temperaturesupporting
confidence: 91%
“…In particular, oxides damaged by avalanche electron injection generated defects that could be repeatedly charged and discharged by the appropriate change of gate bias, whereas oxides damaged by avalanche hole injection generated defects that permanently annealed regardless of the gate bias. In other studies by Trombetta et al [7,9] and Freitag et al [6] it was found that the annealing behavior of defects generated by Fowler-Nordheim (FN) tunneling was polarity dependent. Most of the defects generated by Fowler-Nordheim tunneling with a positive gate bias could be repeatedly charged and discharged, whereas FN tunneling with a negative gate bias generated mostly defects whose charge state was not reversible.…”
Section: Introductionmentioning
confidence: 99%
“…These two defects are distinguished by their behavior following generation. It was suggested [6, 7,9] that the trapped hole is a defect located below the silicon bandgap and does not reversibly exchange charge with the silicon substrate. This defect is permanently removed by tunneling into the silicon valence band or by thermal emission to the SiO, valence band.…”
Section: Introductionmentioning
confidence: 99%
“…Next, we examine the role played by gate materials. The devices of Hf-stacks used in this work up to now have a TaN gate and it has been reported that metal gate can substantially enhance the stress-induced positive charging (37,38). The question is whether the process-induced positive charging is also substantially enhanced by metal gate.…”
Section: Impact Of Processingmentioning
confidence: 98%