New method to study unlanded via architecture. Application to advanced interconnects: Al with low k and copper dual damascene

Gayet, Philippe; Lair, C.; Vegt, E. van den

doi:10.1109/iitc.2000.854286

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)

DOI: 10.1109/iitc.2000.854286

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New method to study unlanded via architecture. Application to advanced interconnects: Al with low k and copper dual damascene

Philippe Gayet

C. Lair²,

E. van den Vegt³

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New method to study unlanded via architecture. Application to advanced interconnects: Al with low k and copper dual damascene

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