New method to evaluate materials outgassing used in MEMS thin film packaging technology

In the field of MEMS packaging technology the pressure limit inside the cavity is a crucial parameter. As the cavity size becomes smaller and smaller the vacuum is mainly affected by the outgassing of the materials used in the fabrication process. A full characterization of this phenomenon for oxides that can be integrated as encapsulation layer is presented in this study. A combination of dynamic outgassing, Residual Gas Analysis (RGA) and thermodynamic simulations is involved to fully investigate the material outgassing behavior. The temperature and the nature of released gases are evaluated indicating the optimal annealing or other cleaning process before the sealing of cavities. Moreover the combination of these oxides with a getter material is analyzed. The affinity between carbon dioxide, nitrogen, hydrogen and the getter material is demonstrated as well as its non-reactivity with hydrocarbons. The pressure inside the cavity can be efficiently decreased by integrating this pumping material. Therefore a selection of materials and new fabrication processes can be considered using those results.

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“…The experimental procedure has already been presented in previous studies [7][8]. It is based on the sealing of samples in a glass ampoule.…”

Section: Outgassing Characterization Methodsmentioning

confidence: 99%

Outgassing characterization of MEMS thin film packaging materials

Savornin

Baillin

Blanquet

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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“…Design of human being intelligent simulation control. The human being intelligent simulation control can be designed by the production rules [5][6][7][8]. Here, providing that E k is as the k th cycles' positioning error which the approaching switch's bottom level relatively to the packaged materials' level (mm); E 0 , when the manipulator locates at original position, the distance value of the approaching switch's bottom level relatively to the packaged materials' level (mm); E 1 is as, when the manipulator moves down and the velocity gets the Max.…”

Section: Experimental Study For the Vertical Movements Of The Manipul...mentioning

confidence: 99%

A Study on the Key Technologies of a Kind of Automatic Packaging System

Chen

Wang

2014

AMM

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In order to improve the productivity of the filing form materials continuously and automatically packaged line, the control methods for the manipulator and the mechanism which has the capacity of weight self-measuring and auto–filling to the packaged material were studied. The manipulator is a pneumatic control system, it is consists of three pneumatic cylinder circuits to implement the horizontal movements, vertical movements and the activities of picking up or putting down the materials on line. The material to be picked up by manipulator was weighed and displayed by a single chip microcomputer. The general control function of the system was carried out by a PLC unit. The structure changeable type of simulating human being intelligence control methods resulting in the real observing at the objective changes were studied and implemented to achieve the plant high in positioning accuracy and fast in response speed. The experiments were realized and the results showed that the working period time is less than 5.8s,the weight variation measured by single chip microcomputer is not more than 2 grams in 300 grams.

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Packaging

Brand¹,

Achour²

2016

Reference Module in Materials Science and Materials Engineering

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New method to evaluate materials outgassing used in MEMS thin film packaging technology

Cited by 4 publications

References 10 publications

Outgassing characterization of MEMS thin film packaging materials

Outgassing characterization of MEMS thin film packaging materials

A Study on the Key Technologies of a Kind of Automatic Packaging System

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