New Method of Measurements Transient Thermal Impedance and Radial Power of Power LEDs

Górecki, Krzysztof; Ptak, Przemysław

doi:10.1109/tim.2019.2894043

Cited by 27 publications

(21 citation statements)

References 35 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The analysis of uncertainty of the performed measurements can be carried out on the basis of considerations presented in the paper [38]. The value of a relative uncertainty of measurements of the considered transient thermal impedances at the steady state does not exceed 10 %, whereas the uncertainty of temperature measurements performed using the infrared camera does not exceed 2 K [35].…”

Section: Measurement Methodsmentioning

confidence: 99%

Modelling thermal properties of large LED modules

Ptak

Górecki

Dziurdzia

2019

Materials Science-Poland

View full text Add to dashboard Cite

In this paper a problem of modelling thermal properties of large LED modules is considered. The compact thermal model of such modules is proposed. The form of this model is presented and a method of parameters estimation is described. The practical usefulness of this model is verified experimentally by comparing the results of calculations and measurements of internal temperature of selected LEDs included in LED modules. The modules were fabricated by Fideltronic, Poland and measurements of temperature distribution on the surface of the modules at selected variants of power dissipation were performed at the Gdynia Maritime University. Good agreement between the results of measurements and modelling was obtained.

show abstract

Section: Measurement Methodsmentioning

confidence: 99%

Modelling thermal properties of large LED modules

Ptak

Górecki

Dziurdzia

2019

Materials Science-Poland

View full text Add to dashboard Cite

show abstract

“…When D pdcm was adjusted from 0.1 to 1, and the temperatures were changed from −20 • C to 40 • C, the RMS forward-biases of the BBLDs were increased, resulting in an increase in electrical powers, as shown in Figure 14. Substituting the measurement results (Figures 10 and 13) into Equation (7), the EOC efficiencies of the three BBLDs can be obtained, as shown in Figure 15. In the electrical power calculation conducted using the electrical power RMS value, the EOC efficiencies presented a desirable result because their variations can be similar to the average current modulation (Figure 10).…”

Section: Eoc Efficiency Estimation Using Electrical Power Rms Valuementioning

confidence: 99%

“…When D pdcm was adjusted from 10% to 100% and the temperature was changed from −20 • C to 40 • C, the forward-bias RMS value of the BBLDs was increased, resulting in an increase in electrical powers, as illustrated in Figure 17. Substituting the measurement results (Figures 16 and 17) into Equation (7), the EOC efficiencies of the three BBLDs can be obtained, as shown in Figure 18. Substituting the measurement results (Figures 21 and 22) into Equation (7), the EOC efficiencies of the three BBLDs can be obtained, as shown in Figure 21.…”

Section: Eoc Efficiency Estimation Using Electrical Power Rms Valuementioning

confidence: 99%

“…However, light-emitting diodes (LEDs) are another headlight selection because they have many merits, including direct-current (DC) driving, dimmable, high luminance and cost-saving. Therefore, LEDs have been replaced the gas discharge bulbs for the high-beam headlights [4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

“…Therefore, several optoelectronic semiconductor manufacturers have been developing laser diodes of high current density for the optical output power (OOP) laser diodes. Several manufacturers, including BMW, Audi and SHARP, have invested in the development of laser headlights [4][5][6][7]. A few articles have discussed laser headlights for vehicles, with [8] being one such article.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Employing a Laser Headlight Electrical System to Measure and Calculate Electro-Optic Conversion Efficiencies of Blue-Beam Laser Diodes

2020

View full text Add to dashboard Cite

In this study, a laser headlight electrical system was developed and implemented to measure and compare the electro-optic characteristics of the blue-beam laser diodes (BBLDs). To observe different temperatures (from negative to positive temperatures) that cause optical output power (OOP) and electrical power variations of the BBLDs, BBLDs were placed in an ambient temperature testing chamber, and the electro-optic characteristics of the BBLDs were measured to estimate the electro-optic conversion efficiencies. The different OOPs and electro-optic conversion efficiencies at different temperatures can be obtained when OOP adjustment was performed by average current and low-frequency pulse-duty cycle modulation technologies. Moreover, this study developed a human–machine interface using the LabVIEW software; therefore, the laser headlight electrical system can be controlled and monitored by a computer with the controller area network (CAN) bus communication. Finally, the prototype of the laser headlight electrical system was achieved, and three BBLDs were driven; furthermore, the white light of the headlight can be produced by mixing blue laser beams with a yellow fluorescence ceramic wafer.

show abstract

Analytical thermal resistance network model for calculating each mean die temperature of the multi-chips module combined with quad flat no-leads packaging

Wang,

Liu,

Wang

et al. 2023

AIP Advances

View full text Add to dashboard Cite

With the rapid advancement of next-generation communication technology, traditional Quad Flat No-leads (QFN) packaging is facing challenges to meet functional requirements. Due to its high integration and excellent thermal performance, the Multi-chips Module combined with Quad Flat No-leads (MCM-QFN) packaging is gaining popularity. However, the structural complexity of MCM-QFN packaging and the thermal coupling effect between multiple dies make it challenging to analyze the steady-state thermal distribution of MCM-QFN packaging, which is necessary for assessing the reliability and optimizing the layout design of the multi-chips module. By analyzing the heat dissipation path from each die to the ambient, this paper proposes an analytical thermal resistance network model for calculating each mean die temperature of MCM-QFN packaging. The thermal coupling effect among the multi-chips, the thermal spreading resistance between critical layers, and the boundary conditions and cooling conditions are all considered. All thermal resistances in the model are expressed analytically, and the mean temperature of each chip can be calculated within 0.1 s using MATLAB programming. To validate the accuracy of the proposed model, finite element method (FEM) simulations are conducted to provide a reference for the mean temperature of each chip under four sets of thermal conditions. The data comparison demonstrates that the analytical model is fast and accurate in calculating each mean die temperature of MCM-QFN packaging, with a maximum error of 3.72%, and the calculation speed increased by about 600× compared to that of FEM simulation. Furthermore, the analytical model is able to offer a direction for optimizing the layout design and material selection of MCM-QFN packaging.

show abstract

New Method of Measurements Transient Thermal Impedance and Radial Power of Power LEDs

Cited by 27 publications

References 35 publications

Modelling thermal properties of large LED modules

Modelling thermal properties of large LED modules

Employing a Laser Headlight Electrical System to Measure and Calculate Electro-Optic Conversion Efficiencies of Blue-Beam Laser Diodes

Analytical thermal resistance network model for calculating each mean die temperature of the multi-chips module combined with quad flat no-leads packaging

Contact Info

Product

Resources

About