New Metalized Polyimide Films Structure and Physical Properties

Abstract

Abstract:The classical techniques of PI film metallization by either vapour deposition or electrochemical reduction of metals involve necessary technological steps such as polymer surface modification via plasma or ion beam, electron beam, or photolytic treatment, or surface sensitization by the conferment of catalytic properties, in order to enhance metal-PI adhesion, which is the main problem to be overcome in all processes.The technology presented differs by the use of another chemical approach yielding electro-conductive materials with high reflectivity, but without damaging the films in the process. The metalized polyimide films have been prepared by heterogeneous chemical modification of the polyimide surface and the suggested technology includes several chemical conversion steps (hydrolysis, chelating by metal salts and reduction) requiring no complicated procedures and proceeding under mild conditions, at room temperature and without aggressive agents. This new process allows the formulation of metal phase while both simplifying the technology and making use of commercial PI films, such as Kapton HN and Upilex S.

Metallized polyimide films for biomedical applications: X‐ray photoelectron spectroscopy, surface tension, and blood compatibility studies

“…The available reports mainly deal with commercial structures (Kapton) and highlight fundamental aspects regarding the mechanism of the metallization process, effect of the electron irradiation on thermal conduction of metalized PI, describe certain techniques of PI film metallization, while indicate the practical use as filters for X-Ray astronomy, circuit boards using TAB (tape automated bonding), magnetic tape and space applications. [26][27][28][29][30][31][32] For example, Ramos [33] performed a theoretical study on bonding strength of metal/Kapton commercial PI interface. By means of self-consistent molecular dynamics, it was shown that despite the low charge transfer between PI and selected metals (Cu, Ni, Cr), the bond formation generates charge rearrangement along the polymer atoms away from the reaction site.…”