2004
DOI: 10.1007/s00542-004-0425-0
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New electroforming technology pressure aid for LIGA process

Abstract: A new microelectroforming technique using air-pressure assistance in the electrolyte is introduced. The related theories and experiments are reported in this paper. The pressurized electrolyte reduces hydrogen bubble formation and defect on the substrate surface. The high pressure electrolyte limits bubble formation in electroforming. It also produces good throwing power from the experimental sample observations. The edges of the electroformed workpiece using the pressurized method were smoother than those pro… Show more

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Cited by 21 publications
(16 citation statements)
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References 9 publications
(4 reference statements)
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“…The surface morphology of the pressurized electroformed mold is improved compared with the conventional method. Furthermore, the deposited nickel hardness is increased by about 20%, when the electrolyte pressure is increased to 3.25 kg cm −2 [12]. The electrolyte pressure is set at 4 kg cm −2 in this research.…”
Section: Experiments Structure and Resultsmentioning
confidence: 95%
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“…The surface morphology of the pressurized electroformed mold is improved compared with the conventional method. Furthermore, the deposited nickel hardness is increased by about 20%, when the electrolyte pressure is increased to 3.25 kg cm −2 [12]. The electrolyte pressure is set at 4 kg cm −2 in this research.…”
Section: Experiments Structure and Resultsmentioning
confidence: 95%
“…A new micro-electroforming technique using air-pressure assistance in the electrolyte is used in this work [12]. The pressurized electrolyte reduces hydrogen bubble formation and defect on the electroforming surface.…”
Section: Experiments Structure and Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Not until more than 100 years later, i.e. after 1950, was electroforming used extensively in the industry [13]. In addition to making printing plates, plastic forming/moulding moulds, screens, and many other products, electroforming was also used to manufacture individual parts, which were usually difficult to manufacture using conventional machining [14].…”
Section: Studies Before the 2000smentioning
confidence: 99%
“…Controlling deposition uniformity is vital when electroforming micro/nanostructures. Many methods are discussed in the literature to improve the uniform thickness of a deposit, including using (1) pulse reverse current [83]; (2) rotated and moving cathodes [25]; (3) a second cathode [84]; (4) ultrasonic and air-pressure agitation [13,85]; (5) an insulating shield [86]; (6) an auxiliary anode [87]; (7) controlling the size, shape, and placement of the anode [88]; (8) adjusting electrolyte composites [89]; and (9) optimizing process parameters [90].…”
Section: Thickness Uniformitymentioning
confidence: 99%