New double sided SMT power inductor

Josifovic, I.; Popović, Jelena; Ferreira, J.A.

doi:10.1109/ipec.2010.5544635

Cited by 5 publications

(4 citation statements)

References 7 publications

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“…The role of induction coil is electricity transmission, which transfers the electrical energy into heat energy within the metal artifacts [5]. Its power can be expressed as = 0.24 …”

Section: The Principle Of Single Induction Heatingmentioning

confidence: 99%

Single-Sided Electromagnetic Induction Heating Based on IGBT

Wang

2014

Advances in Mechanical Engineering

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A single-sided induction heating system based on IGBT is proposed. The system includes the series resonant circuit, control circuit, and auxiliary circuit. The main circuit includes rectifier, filter, inverter, and resonant circuit. A drive circuit is designed for IGBT combing some protection circuits. We have a simulation of the single-sided induction heating system in ANSYS. The simulation results are compared with the experimental results. The performance of the system is promising. And also we estimate the temperature distribution model by the least squares theory.

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“…The role of induction coil is electricity transmission, which transfers the electrical energy into heat energy within the metal artifacts [5]. Its power can be expressed as = 0.24 …”

Section: The Principle Of Single Induction Heatingmentioning

confidence: 99%

Single-Sided Electromagnetic Induction Heating Based on IGBT

Wang

2014

Advances in Mechanical Engineering

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“…The SMT inductors are designed with optimum number of turns by means of an analytical method [8]. Because of a larger air gap and non-uniform core cross section area, the final inductance value and magnetic flux density are calculated with the aid of FEM to include fringing field effects as shown in [8].…”

Section: A the Power Sandwich -Concept Overviewmentioning

confidence: 99%

“…Because of a larger air gap and non-uniform core cross section area, the final inductance value and magnetic flux density are calculated with the aid of FEM to include fringing field effects as shown in [8]. Fig.…”

Section: A the Power Sandwich -Concept Overviewmentioning

confidence: 99%

Power Sandwich: An integration technology for manufacturability

Ferreira

Popović

Josifovic

2010

The 2010 International Power Electronics Conference - ECCE ASIA -

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This paper presents a novel power electronics construction technology for surface mount technology (SMT) automated manufacturing of power convertersPower Sandwich. The Power Sandwich manufacturing method employs new x-dimension components, having the same height (x) and double sided SMT electrical terminations. The components are stacked between planar substrates and can be soldered on both, top and bottom sides using the multilayer Power Sandwich assembly process. The process is compatible with standard SMT assembly line with some alternations. By arranging the components in different stack layers an increase in power density and better heat removal from the systems can be achieved. Power Sandwich is an enabling integration technology for achieving both SMT automated construction and high power densities of power electronics converters.

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“…In Power Sandwich technology, x-dimension (x-dim) components which have standardized geometry (shape and height), double-sided SMT mounting and enhanced thermal properties (Fig. Ia) [10], are stacked between planar substrates. The components have flat surfaces, are suited for conduction heat removal and can be soldered to both top and bottom PCB substrates.…”

Section: Introductionmentioning

confidence: 99%

Thermal performance of double-sided SMT capacitors: Operation and soldering

Josifovic

Huesgen

Popović

et al. 2013

2013 IEEE ECCE Asia Downunder

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This manuscript investigates thermal performance of x-dimension (x-dim) passive components, during operation and soldering by means of 3D FEM thermal simulations and experiments. X-dim components feature standardized height, double-sided SMT terminations, and improved thermal behaviour and can be stacked between PCBs to achieve 3D spatial layout. During components operation, standard passives with different shapes are suitable for convection-while x-dim components with standardized geometry, for conduction heat transfer from their surfaces. Conduction heat transfer is found to be more effective than convection, especially for passives inside a sealed enclosure. Further, the paper shows how x-dim components can be utilized for the heat conduction from other passives in a stacked assembly. With respect to reflow soldering of passives, phase-change-is clearly identified as superior over convection-heat transfer. Phase-change soldering is, through number of thermal simulations and experiments, proven to be effective for soldering of power passive x-dim components.

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New double sided SMT power inductor

Cited by 5 publications

References 7 publications

Single-Sided Electromagnetic Induction Heating Based on IGBT

Single-Sided Electromagnetic Induction Heating Based on IGBT

Power Sandwich: An integration technology for manufacturability

Thermal performance of double-sided SMT capacitors: Operation and soldering

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