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2011
DOI: 10.1116/1.3656055
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New diamond nanofabrication process for hard x-ray zone plates

Abstract: The authors report on a new tungsten-hardmask-based diamond dry-etch process for fabricating diamond zone plate lenses with a high aspect ratio. The tungsten hardmask is structured by electron-beam lithography, together with Cl2/O2 and SF6/O2 reactive ion etching in a trilayer resist-chromium-tungsten stack. The underlying diamond is then etched in an O2 plasma. The authors demonstrate excellent-quality diamond gratings with half-pitch down to 80 nm and a height of 2.6 μm, as well as zone plates with a 75 μm d… Show more

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Cited by 16 publications
(12 citation statements)
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References 14 publications
(18 reference statements)
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“…As a last step the chromium layer was removed. The fabrication process is identical to that described in [11], except that the diamond etch step was omitted here. The resulting gratings had a period of 200 nm, a thickness of approximately 350 nm and a size of 200 µm × 200 µm.…”
Section: Fabrication Of Tungsten Nanostructures and Zone Platesmentioning
confidence: 99%
“…As a last step the chromium layer was removed. The fabrication process is identical to that described in [11], except that the diamond etch step was omitted here. The resulting gratings had a period of 200 nm, a thickness of approximately 350 nm and a size of 200 µm × 200 µm.…”
Section: Fabrication Of Tungsten Nanostructures and Zone Platesmentioning
confidence: 99%
“…The Ronchi grating was made of diamond [8] and had a thickness of 1.5 μm with an additional layer of 250 nm tungsten on top, giving a first-order diffraction efficiency of roughly 13%. A grating period of 200 nm matches the numerical aperture of the focusing zone plate, ensuring optimum overlap of the zeroth and first orders as in Fig.…”
mentioning
confidence: 99%
“…Current methods used to produce X-ray diffractive optics include top-down methods involving patterning of a thick resist mould 6,7 , pattern transfer into a substrate using deep reactive ion etching [8][9][10] , anisotropic Si wet etch 11,12 , multiple patterning techniques 13 , multilayer Laue lens, various multilayer-sliced zone plate techniques 14 , lithographic stacking 15 and mechanical stacking 16 . Advantages and tradeoffs exist with each method.…”
mentioning
confidence: 99%