New Diagnostic Forensic Protocol for Damaged Secure Digital Memory Cards

Thomas-Brans, F.; Heckmann, Th.; Markantonakis, Konstantinos; Sauveron, Damien

doi:10.1109/access.2022.3158958

Cited by 4 publications

(2 citation statements)

References 28 publications

(26 reference statements)

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“…These examinations encompass both internal and external evaluations aimed at scrutinizing the component's construction, packaging, and leads. External tests, such as low-power visual inspection (LPVI) [39], blacktop testing [40][41][42], microblast analysis [43][44][45], hermiticity testing [46][47][48], scanning electron microscopy (SEM) [49][50][51][52], and scanning acoustic microscopy (SAM) [53][54][55], focus on assessing the component's exterior characteristics. The method of low-power visual examination (LPVI) uses tools like microscopes, digital cameras, or infrared light sources to inspect essential markings on package-level electronics and identify indications of previously used or recycled items, including marks on the package or leftover solder on IC connectors.…”

Section: Physical Inspectionsmentioning

confidence: 99%

Building Trust in Microelectronics: A Comprehensive Review of Current Techniques and Adoption Challenges

Nyako,

Devkota,

et al. 2023

Electronics

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The field of microelectronics has experienced extensive integration into various aspects of our everyday lives, evident via its utilization across a wide range of devices such as cellphones, airplanes, computers, wristwatches, and other similar technologies. Microelectronics are vital to the healthcare and defense industries, making them vulnerable to counterfeit products. Currently, the complicated global microelectronics supply chain involves the production of varied components in multiple places, resulting in tremendous risk. In this scenario, it is possible for hostile or adversarial actors to exploit the situation by intentionally introducing counterfeit components. This hostile behavior could steal data or use these components as remote kill switches. To address these problems, enormous resources are being committed to research, innovation, and development to build trust in microelectronics. This research study provides a thorough analysis of the taxonomy associated with prominent attack, detection, and avoidance models in the realm of counterfeit microelectronics. This research aims to improve our understanding of dependable microelectronics. Prevention strategies like Physical Unclonable Functions (PUFs) and machine learning (ML), and detection methods like aging-based fingerprints are reviewed in this study. Finally, we underscore the significance of interdisciplinary cooperation, commitment to norms, and proactive methods.

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Section: Physical Inspectionsmentioning

confidence: 99%

Building Trust in Microelectronics: A Comprehensive Review of Current Techniques and Adoption Challenges

Nyako,

Devkota,

et al. 2023

Electronics

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“…However, the use of micro-SD poses a risk of data loss or damage due to malfunction. Another device used for measurement was developed with a humidity and temperature sensor mounted on the project board Wi-Fi module, but it could only be used on the surface of the soil [28].…”

Section: Introductionmentioning

confidence: 99%

Optimization of Soil Temperature and Humidity Measurement System at Climatology Stations with IoT-Based Equipment

Yulkifli,

Nofriandi,

Sari

et al. 2023

Int. J. Adv. Sci. Eng. Inf. Technol.

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Temperature and humidity are important weather parameters that require close observation due to their importance across various fields, including agriculture. Apart from the use of automatic weather system (AWS), the station of meteorology and climatology also relies on conventional devices to observe these parameters, but they have been proven to be inefficient, imprecise, and prone to systematic errors. The alternative AWS consists of several sensors with different functions, allowing for more accurate measurements, but it also has one major limitation. This includes its inability to carry out measurements with the sensors when one of them is damaged. Therefore, this study aims to develop high-precision soil temperature and humidity (STH) monitoring equipment using the DHT11 sensor module. The equipment consisted of a box containing a series of device builder electronics. The building electronics circuit contained a DHT11 sensor, NodeMCU ESP8266 microcontroller, an on/off switch, and a reset button. The results of measurements of temperature and humidity often appeared on the smartphone. The DHT11 sensor detected the soil parameters, which were processed by the NodeMCU ESP8266. The data obtained were then sent to the Thingspeak server, where they could be accessed on a smartphone. The developed equipment showed good performance with accuracies of 98.201%, 97.330%, 98.982%, 98.973%, and 99.649% in measuring STH at each depth, while values of 98.487% and 98.587% were obtained for humidity measurement. Furthermore, precision values of 99.93% and 99.95 were recorded for the measurement of temperature and humidity

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