New construction of electron thermal conductive route for high-efficient heat dissipation of graphene/Cu composite

Li, Xiaofang; Tan, Chunlei; Jiang, Juantao; Wang, Shaoyi; Zheng, Fenghua; Zhang, Xiaohui; Huang, Youguo; Li, Qingyu

doi:10.1016/j.carbon.2021.01.157

Cited by 28 publications

(13 citation statements)

References 50 publications

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“…40 The I D / I G value of PA−Gr−Cu can be calculated as 0.33 from Figure 3, which is slightly lower than that of PA−Gr and indicates that the co-electrodeposition process has little impact on the graphene structure, in accordance with our previous reports. 25 Figure 4a shows the surface morphology of the prepared PA−Gr−Cu composite films. A dense copper−graphene film is formed on the Cu substrate due to the codeposition of Cu 2+ ions and PA−Gr, where PA−Gr was embedded into the deposited copper steadily due to the simultaneous deposition of Cu 2+ ions.…”

Section: Resultsmentioning

confidence: 99%

“…The preparations of phenylaminefunctionalized graphene via a diazotization reaction and graphene−Cu composite were performed according to our previous work. 25 The details of these preparations are shown in the Supporting Information. Phenylamine-functionalized graphene is denoted as PA−Gr.…”

Section: Methodsmentioning

confidence: 99%

“…24 Recently, we first proposed a new electron thermal conduction route by the establishment of a delocalized π−π conjugated system between graphene and Cu except for the traditional phonon thermal conduction route. 25 In this material, the masses of electrons in the big π bond of graphene could move to Cu unimpededly. The newly established delocalized π−π conjugated system showed an extremely high TC, especially at high temperatures, such as 497 W m −1 K −1 at 100 °C, which demonstrated the feasibility and innovation of the electron thermal conduction route.…”

Section: Introductionmentioning

confidence: 96%

“…In our previous work, a covalent Cu–O–Si–O–C bond was constructed to link graphene oxide (GO) and Cu, which resulted in a 5.01–6.00% higher TC than that of pristine GO/Cu . Recently, we first proposed a new electron thermal conduction route by the establishment of a delocalized π–π conjugated system between graphene and Cu except for the traditional phonon thermal conduction route . In this material, the masses of electrons in the big π bond of graphene could move to Cu unimpededly.…”

Section: Introductionmentioning

confidence: 99%

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Phenylamine-Functionalized Graphene–Copper Composites with High Thermal Conductivity: Implications for Thermal Dissipation

et al. 2021

ACS Appl. Nano Mater.

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Developing highly efficient thermal management techniques is crucial in order to achieve the best performance of electronic equipment. Here, a delocalized conjugated system was established by the conjugation of sp 2 orbitals in phenylamine groups and a delocalized big π bond in graphene to construct an electron thermal conduction route. Then, the abundant π electrons in graphene can be transferred to the adjacent copper unimpededly, leading to a remarkable thermal conductivity. These results demonstrate that the copper substrate deposited with phenylamine-functionalized graphene (PA−Gr−Cu) shows a high thermal conductivity of 506 W m −1 k −1 , which is 30.8 and 44.2% higher than those of the pristine graphene−copper composite (Gr−Cu) and copper (Cu), respectively. Placed on a heat source heated from 30 to 210 °C within 5 min, the top surface temperature of PA−Gr−Cu increases to 198 °C rapidly, whereas those of Gr−Cu and Cu only increase gently to 88 and 59 °C. This work demonstrates that phenylamine with a pair of lone electrons in the N atom shows superiority as an intermediate molecule to link graphene and copper to establish a delocalized conjugated system. This innovation provides another solution to establish a conjugated structure between graphene and copper to construct an electron thermal conduction route with remarkable thermal conduction properties and will promote the research on the electron thermal conduction route for graphene-based metal matrix composites in the application of thermal dissipation.

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Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 96%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Phenylamine-Functionalized Graphene–Copper Composites with High Thermal Conductivity: Implications for Thermal Dissipation

et al. 2021

ACS Appl. Nano Mater.

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“…The shape recovery behaviors could be more rapid, promoting the enhancement of the shape memory effect (SME). [ 28–30 ] The construction of heat conduction path in SMPs system is significantly efficient, [ 31,32 ] which could be generally achieved through the integration of thermal conductive fillers, such as boron nitride (BN), [ 33,34 ] graphene, [ 35 ] silicon carbide, [ 36 ] and so on.…”

Section: Introductionmentioning

confidence: 99%

Boron nitride enhanced shape memory poly(aryl ether ketone) actuators with rapid self‐deformation and staged responsive behaviors

Yang

Leng

2022

Polymer Composites

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In this paper, boron nitride (BN) sheets, as two‐dimensional thermal conductive fillers, were integrated into shape memory poly(aryl ether ketone) (PAEK) matrix to improve the response speed of actuators. The thermal conductivity of composites was found to be positively correlated with the content of BN sheets. Significantly, a highest in‐plane thermal conductivity of 2.66 W m−1 K−1 was obtained, which resulted in the increase of the recovery speed of the PAEK/BN actuators from 18 to 6 s. Besides, the integration of BN sheets improved the shape memory effect of PAEK matrix, including the higher shape recovery ratio (up to 99.9%) and fixity ratio (over 97%). In addition, through the assembling of four components with designed BN contents, we achieved the interesting staged shape recovery behaviors for PAEK/BN composite actuators, which enabled programmable and smart manipulations. These fabricated PAEK/BN composite actuators with rapid response and staged deformation behaviors possessed the wide utilization potential in smart devices.

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Preparation of Cu‐W Nanoflakes and their Catalytic Performance for the Hydrogenation of 4‐Nitrophenol

et al. 2023

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4‐Nitrophenol (4‐NP) is one of the most common organic pollutants in industrial waste waters due to its solubility and toxicity. The catalytic degradation of 4‐NP to 4‐aminophenol (4‐AP) is an economical and sustainable process, which transfers waste and toxicity to profitable materials. Fabricating metal nanoparticle based efficient heterogeneous catalysts is crucial to treating these kinds of pollutants. Here in, Cu−W nanoflakes (Cu−W NFs) with thin sheet like structure were prepared by a simple one‐pot method by using polyoxometalate as precursor. The Cu−W NFs served in hydrogenation of 4‐NP reaction as catalyst, achieved high conversion with rate constant (k) of 2.584×10−2 s−1. Notably, the sustainable catalyst Cu−W NFs exhibit no significant degradation of catalytic activity over 16 cycles, manifested good durability and high conversion (>91 %). Also, the reduction of potassium ferricyanide can also be catalyzed by Cu−W NFs with high efficiency. This work provided a concise approach for fabricating highly effective catalyst and was expected to be a potential universal method to obtain sustainable competitive catalyst for utility in treating pollution.

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New construction of electron thermal conductive route for high-efficient heat dissipation of graphene/Cu composite

Cited by 28 publications

References 50 publications

Phenylamine-Functionalized Graphene–Copper Composites with High Thermal Conductivity: Implications for Thermal Dissipation

Phenylamine-Functionalized Graphene–Copper Composites with High Thermal Conductivity: Implications for Thermal Dissipation

Boron nitride enhanced shape memory poly(aryl ether ketone) actuators with rapid self‐deformation and staged responsive behaviors

Preparation of Cu‐W Nanoflakes and their Catalytic Performance for the Hydrogenation of 4‐Nitrophenol

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