New concepts in OPC

Cobb, Nick; Granik, Yuri

doi:10.1117/12.535605

Cited by 24 publications

(10 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…7 In addition, Cork et al mathematically described the target contour to best realize design intent, 8 and Yenikayaanf and Sezginer tried to determine printability of a target layout by mathematical inequalities. 9 There are also other papers discussing the new concepts in OPC 10,11 and layout printability. [12][13][14][15] However, few attempts have been conducted on the contour-based OPC strategy.…”

Section: Introductionmentioning

confidence: 97%

Study of the contour-based optical proximity correction methodology

Kang¹

2009

J. Micro/Nanolith. MEMS MOEMS

View full text Add to dashboard Cite

As design rule continues to shrink, resolution enhancement techniques ͑RET͒ such as optical proximity correction ͑OPC͒ become more and more complex to enable design printability. As we know, typically integrated circuit ͑IC͒ layouts are simple shapes such as rectangles. However, high spatial frequency components of the mask spectrum that are not captured by the low-pass pupil result in a rounded image. In addition, the diffusion process in the postexposure bake ͑PEB͒ step makes the wafer rounding effects worse. This means that it is difficult to get the wafer image to match the design exactly at corners, even with the most aggressive OPC methodology. Therefore, pre-OPC site placement optimization is necessary to achieve high quality wafer images. In this work, a contour-based OPC methodology is proposed to minimize the time consumption in pre-OPC simulation site placement optimization and OPC job running. Rounded target contours that best describe the real intended wafer result are used as the target during OPC correction. By comparing classical OPC recipe-driven target point placement and contour-based OPC methodology, it is found that contour-based OPC methodology can achieve comparable image quality in a shorter turn around time ͑TAT͒ with fewer engineer resources.

show abstract

Section: Introductionmentioning

confidence: 97%

Study of the contour-based optical proximity correction methodology

Kang¹

2009

J. Micro/Nanolith. MEMS MOEMS

View full text Add to dashboard Cite

show abstract

“…D URING the past two decades, Optical Proximity Correction (OPC) [1], [2] has been evolving from rulebased mask correction to Model-Based OPC (MBOPC) targeting the geometrical design fidelity and achieve the designers geometrical design intent on wafer. Later on, OPC has also provided the means of preventing catastrophic Process Window (PW) failures on wafer through Process Window OPC (PWOPC) [3], [4] methodology, where the cost function used in OPC correction is not only the Edge Placement Error (EPE) between the design and the wafer print image but also includes the worst-case scenarios of the on-wafer printing within the process window variations.…”

Section: Introductionmentioning

confidence: 99%

AIR (Aerial Image Retargeting): A novel technique for in-fab automatic model-based retargeting-for-yield

Hamouda¹,

Anis²,

Karim³

2012

2012 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

View full text Add to dashboard Cite

In this paper, we present a novel methodology for identifying lithography hot-spots and automatically transforming them into the lithography-friendly design space. This fast modelbased technique is applied at the mask tape-out stage by slightly shifting and resizing the designs. It implicitly does a similar functionality as that of the Process Window OPC (PWOPC) but more efficiently. Being a relatively fast technique it also offers the means of providing the designer with all the design systematic deviations from the actual (on-wafer) parameters by including it in the parameter-extraction flow. We applied this methodology successfully to 28-nm Metal levels and showed that it efficiently (better quality and faster) improves the lithography-related yield and reliability issues.

show abstract

“…For rules based OPC, problems can arise because the rules are created using a 1D and simple 2D approach, but actual designs contain a variety of complex 2D geometries. For model based OPC, issues such as non-convergence and insufficient fragmentation can cause OPC errors 3 . One approach to this problem is to increase the "robustness" of the OPC algorithm and models, for example by the use of a model based verification technique 4-5 on extensive sets of test patterns.…”

Section: Introductionmentioning

confidence: 99%

Model-based verification for first time right manufacturing

Bruce¹,

Conrad²,

Dick³

et al. 2005

Design and Process Integration for Microelectronic Manufacturing III

View full text Add to dashboard Cite

In this paper we will describe the implementation of a system for model-based verification of post OPC data into a manufacturing data flow. Verification is run automatically, upon OPC completion, on the critical levels for every chip run in the 130nm node and beyond to ensure that OPC errors are caught before hardware is committed in the manufacturing line. The checks are derived from the design rule manual, and are written to cover the intent of the design rules. Some of the challenges of implementing a robust model-based verification solution for manufacturing will be discussed, including resource requirements, data management, cycle time, and the creation of a closed loop system to ensure that verification is completed on all chips. The benefits of implementing model-based verification include improved feedback to lithography and OPC teams, enabling constant improvement, as well as increasing the probability of first time right manufacturing of a new chip design.

show abstract

New concepts in OPC

Cited by 24 publications

References 7 publications

Study of the contour-based optical proximity correction methodology

Study of the contour-based optical proximity correction methodology

AIR (Aerial Image Retargeting): A novel technique for in-fab automatic model-based retargeting-for-yield

Model-based verification for first time right manufacturing

Contact Info

Product

Resources

About