New approach of friction AlN ceramics metallization with the initial FEM verification

Abstract

Although, the friction method is well known for metals surface modification, the novelty of the article is based on the new idea of ceramics surface treatment with metal. The paper describes AlN ceramic metallization process by titanium coating deposition, obtained in friction surfacing method, which has been developed by the authors. The friction energy is directly transformed into heat and delivered in a specified amount precisely to the joint being formed between the metallic layer and the ceramics substrate material. The stress and temperature fields (as factors promoting the formation of diffusion joints) induced in the joint during the metallization process were qualitatively determined with the finite element method analysis and these results were verified experimentally. Finally, obtained structures of the metallic coatings were investigated and the results are discussed in the paper. As a novelty it was found, that the conditions of frictional metallization can favour the formation of a coating-substrate bond based on diffusion phenomena and atomic bonds of the coating components with the components of the substrate, despite the fact that it happens for metal–ceramics pairs. This type of connection is usually associated with long-term heating/annealing in chamber furnaces, because for diffusion in a solid state the most effective factor is time and temperature. It was shown that other components of the chemical potential gradient, such as temperature gradient, gradient and stress level, load periodicity and configuration of pairs of elements with high chemical affinity may play an important role in friction metallization. As a result, the relatively short time of operation (friction) is compensated.

Laser Cladding-Based Surface Modification of Carbon Steel and High-Alloy Steel for Extreme Condition Applications

“…For enhanced wear and corrosion properties, scholars adopted various coating techniques. These surface modification methods include physical vapor deposition [9], chemical vapor deposition [10], thermal spray coatings [11], plasma spraying [12], cold spray deposition [13], nitriding [14], boriding [15], carbonitriding [16], carburizing [17] friction surfacing [18], laser surface alloying [19], and laser cladding (LC) [20]. Among the various coating methods developed, LC is considered a prominent surface modification technique capable of delivering excellent wear and corrosion properties to the substrate material [21].…”

Properties of Flame Spraying Coatings Reinforced with Particles of Carbon Nanotubes

“…Depending on the needs of this type of materials may take different form, shape, and size, which is highly desirable in car, aircraft, and space vehicle production. Their usage has many benefits, such as lower fuel consumption, higher load capacity, speed, and easier maintenance by reducing the number of elements [4][5][6]. Dynamic advances in technology development, especially in the field of advanced production technologies led to the development of metal-matrix composites (MMC) [7,8].…”

Formation of Si3N4 coating on SiC substrate by gas transporting self‐propagating high‐temperature synthesis with the addition of NH4Cl

“…[1][2][3] At present, the commonly used alumina substrate has low thermal conductivity and the aluminum nitride is of poor reliability, which limits its application. 4,5 In contrast, the silicon nitride substrate (Si 3 N 4 ) shows high mechanical property, excellent thermal conductivity, consistency with chips, etc. 6 However, the cost of Si 3 N 4 ceramic substrate is much higher than that of alumina and aluminum nitride substrate, which impedes its practical application.…”

“…In recent years, electronic devices have developed toward higher power, density, and integration, the higher requirements have been put forward for ceramic heat sink substrates in devices 1–3 . At present, the commonly used alumina substrate has low thermal conductivity and the aluminum nitride is of poor reliability, which limits its application 4,5 . In contrast, the silicon nitride substrate (Si 3 N 4 ) shows high mechanical property, excellent thermal conductivity, consistency with chips, etc 6 .…”