New Acceleration Factors for Temperature, Humidity, Bias Testing

Sbar, Neil; Kozakiewicz, R. P.

doi:10.1109/irps.1978.362842

Cited by 29 publications

(18 citation statements)

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“…They all incorporate three different types of sensors: temperature, humidity and corrosion, as it was not possible to characterise the gas sensors with the setup. As can be seen, different corrosion structures have been tested, consisting of ladders, edge damage detectors, and a combination of triple track and comb pattern [4], [5], and [6]. A nonpassivated temperature sensor has also been added to monitor the long-term effects of corrosion.…”

Section: Test Settings Of Multiple Mems Sensorsmentioning

confidence: 99%

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Miniaturised multi-MEMS sensor development

Hautefeuille¹,

O’Flynn²,

Peters

et al. 2009

Microelectronics Reliability

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Section: Test Settings Of Multiple Mems Sensorsmentioning

confidence: 99%

“…Therefore, accelerated tests such as the ones described in [4] and [8] were required to test our sensors before they can be deployed outdoors using the Tyndall wireless platforms.…”

Section: Corrosion Sensorsmentioning

confidence: 99%

Miniaturised multi-MEMS sensor development

Hautefeuille¹,

O’Flynn²,

Peters

et al. 2009

Microelectronics Reliability

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“…For the main experiment, the specimens v.'ere subjected to this 'damp-heat' storage for a total of three day but they were removed every 24 hours and a measurement of the capacitance-. ratio made after allowing a 30-minute cool-down period.…”

Section: Experimental Conditionsmentioning

confidence: 99%

“…On completion of the storage in damp-heat, the moisture in the plastic was driven out by placing the specimens in an oven at 110°C for three days. As before, the specimens were removed every 24 hours from this 'dry-heat' to permit measurement of the capacitance-ratio.…”

Section: Experimental Conditionsmentioning

confidence: 99%

“…An alternative approach which merits consideration is to determine whether a short period (24 hours) in a saturated autoclave can produce the conditions -at the die surface -needed to induce degradation. The advantage of this approach is that it would not be necessary to ensure that the duration of the stress was sufficient for these conditions to progressively produce a detectable degradation.…”

Section: Introductionmentioning

confidence: 99%

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NBSRADC workshop moisture measurement technology for hermetic semiconductor devices II

Cohen¹,

Ruthberg²

1982

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(NBS); it was another in a series dedicated to the furtherance of the measurement technology needed by the semiconductor device industry in its attempt to provide to its customers products that are based on the most advanced technology, yet have high reliability and the affordable costs which result from high yields.It was held at the Gai thersburg, Maryland, facility of the National Bureau of Standards on November 5 to 7, 1980, under the cosponsorship of the National Bureau of Standards and the Rome Air Development Center (RADC). Representatives from industrial, governmental, and academic organizations concerned with device manufacture, analysis, and instrument design participated.The workshop provided a forum for reporting the progress that has been made since the previous workshop of March 22 to 23, 1978, in the measurement of moisture in hermetic semiconductor devices, in the correlation between measurements made by different procedures, in test environments, and in-process control.Thirty-six formal talks as well as numerous question and answer sessions were included.The 99 attendees represented a broad spectrum of the semiconductor and related communities concerned with moisture measurement and control.The workshop was hosted by S. Ruthberg of NBS; R. W. Thomas of RADC was chairman; E. C. Cohen of NBS coordinated workshop arrangements; E. J. Walters of NBS provided editorial assistance and supervised processing; and J, S. Halapatz of NBS provided typing and rework.It is hoped that this report will convey the spirit of the workshop to those who could not attend. DisclaimersThe views and conclusions expressed are those of the authors and do not necessarily represent the official policies of the Department of Defense, Department of Commerce, or the United States Government.Certain commercial equipment, instruments, or materials are identified in this report in order to adequately specify the experimental procedure.In no case does such identification imply recommendation or endorsement by the National Bureau of Standards, nor does it imply that the material or equipment identified is necessarily the best available for the purpose.Papers in this volume, except those by National Bureau of Standards authors, have not been edited or altered by the National Bureau of Standards. Non-NBS authors are solely responsible for the content and quality of their submissions. The workshop, one of a series concerned with measurement problems in integrated circuit processing and assembly, served as a forum to examine the progress that has been made in the measurement and control of moisture in hermetically packaged semiconductor devices. While moisture-induced failure modes and mechanisms have been extensively documented, the lack of accurate and reliable measurement of the moisture content itself has been a major obstacle to meaningful efforts to limit and control this pervasive contaminant. Manuscripts are provided of 36 presentations which detail the progress that has been made in mass spectrometer measurements and calibrati...

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