2012 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE) 2012
DOI: 10.1109/date.2012.6176460
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Neighbor-aware dynamic thermal management for multi-core platform

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Cited by 4 publications
(2 citation statements)
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“… , and represent the number of links that pass through the X-dimension, Y-dimension, and Z-dimension from node to node , provided that the shortest possible routing algorithm is adopted. represents the energy consumption of data in transmission in TSV and the ratio of energy consumption in horizontal links (TSV consumes only 7.5% of the communication energy compared to normal horizontal links [ 4 ]).…”
Section: System and Computation Modelmentioning
confidence: 99%
See 1 more Smart Citation
“… , and represent the number of links that pass through the X-dimension, Y-dimension, and Z-dimension from node to node , provided that the shortest possible routing algorithm is adopted. represents the energy consumption of data in transmission in TSV and the ratio of energy consumption in horizontal links (TSV consumes only 7.5% of the communication energy compared to normal horizontal links [ 4 ]).…”
Section: System and Computation Modelmentioning
confidence: 99%
“…In addition, the instantaneous increase in temperature can result in severe system failures, and prolonged overheating can result in the deterioration of the chip’s packaging materials and integrated circuits. This can result in increased cooling costs, reduced reliability, and signal integrity issues [ 3 , 4 , 5 ]. At present, overheating problems are a major issue in the field of IC design, which has led to the emergence of various chip cooling techniques.…”
Section: Introductionmentioning
confidence: 99%