Negative in-plane CTE of benzimidazole-based polyimide film and its thermal expansion behavior

Song, Guangliang; Zhang, Xingdi; Wang, Da-Ming; Zhao, Xiaogang; Zhou, Hongwei; Chen, Chunhai; Dang, Guodong

doi:10.1016/j.polymer.2014.05.041

Cited by 43 publications

(20 citation statements)

References 22 publications

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“…As shown in Figure , one halo was observed with 2 θ varying from 12° to 20° and the calcd d‐space of molecular chains was 0.542–0.601 nm. All the polyimide films owned analogous amorphous morphology which was consistent with DSC measurements, whereas for PI – 4, some slight crystallization peaks were observed, which was probably ascribed to the orientation of molecular chains in imidization process . Fluorinated PI – 5 and PI – 7 exhibited the higher calcd d‐space of molecular chains at 0.592 nm and 0.601 nm than that of the other polyimides containing cis ‐HBPA, which may be attributed that the bulky hexafluoroisopropyl can be more effective in loosening the molecular chain packing.…”

Section: Resultssupporting

confidence: 75%

Transparent and soluble polyimide films containing 4,4′‐isopropylidenedicyclohexanol (Cis‐HBPA) units: Preparation, characterization, thermal, mechanical, and dielectric properties

Liu

Wang

et al. 2018

J. Polym. Sci. Part A: Polym. Chem.

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To develop colorless and soluble polyimide films, cis‐hydrogenated bisphenol A (cis‐HBPA) was successfully separated from HBPA isomers, and two novel monomers containing cis‐HBPA unit, 4,4′‐(4,4′‐isopropenylbicyclohexyloxy) diphthalic anhydride (HBPADA) and 4,4′‐(4,4′‐isopropenylbicyclohexyloxy) dianiline (f) were designed and synthesized. PI–(1 – 5) were achieved from HBPADA and five kinds of aromatic diamines and PI – 6 from HBPADA and semiaromatic diamine f via a two‐step thermal imidization. All the polyimides could afford flexible, tough, and transparent films with transparency as high as 86% at 450 nm. Surprisingly, the polyimides containing cis‐HBPA unit exhibited excellent solubility not only in polar solvents such as N, N‐dimethylacetamide, but also in low boiling solvents such as chloroform and dichloromethane. Additionally, analogues aromatic PI – 7 derived from 4,4′‐(hexafluoroisopropylidene)‐diphthalic anhydride (6FDA) and 2,2‐bis(4‐aminophenyl)hexafluoropropane (e) was obtained for comparison with PI–(1 – 6) on aspects of thermal, mechanical, soluble, optical, electrical, and morphological properties. The structure‐property relationships of PI–(1 – 7) were investigated in detail. © 2018 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2018, 56, 2115–2128

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Section: Resultssupporting

confidence: 75%

Transparent and soluble polyimide films containing 4,4′‐isopropylidenedicyclohexanol (Cis‐HBPA) units: Preparation, characterization, thermal, mechanical, and dielectric properties

Liu

Wang

et al. 2018

J. Polym. Sci. Part A: Polym. Chem.

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“…In the current work, as one of our continuing efforts to develop high-performance PI coatings for high-tech applications, a series of PI coatings containing flexible carbonyl groups, ether linkages, and rigid-rod benzimidazole units were developed. Benzimidazole units have been proven to possess good thermal stability along with excellent adhesion to various substrates due to their ability to form hydrogen bonds via the highly active imidazole ring [27,28,29,30,31,32,33]. Introduction of the rigid-rod benzimidazole and flexible carbonyl groups might endow the PI coatings with good heat resistance and good adhesion to the surface of quartz CCs.…”

Section: Introductionmentioning

confidence: 99%

Preparation and Thermal Evaluation of Novel Polyimide Protective Coatings for Quartz Capillary Chromatographic Columns Operated over 320 °C for High-Temperature Gas Chromatography Analysis

Huangfu

Zhang

et al. 2019

Polymers

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Protection of intrinsically brittle quartz chromatographic columns (CCs) from breakage or property deterioration in gas chromatography (GC) analysis has become an important research topic regarding high-temperature GC techniques. Polyimide (PI) has proved to be the most suitable protective coating for quartz CCs. In the current research, a series of novel high-temperature-resistant PI coatings for quartz CCs operated over 320 °C have been successfully prepared. For this purpose, the aromatic diamine with a rigid skeleton structure 2-(4-aminophenyl)-5-aminobenzimidazole (APBI) was copolymerized with two aromatic dianhydrides—3,3’,4,4’-benzophenotetracarboxylic acid dianhydride (BTDA) and 4,4’-oxydiphthalic anhydride (ODPA)—and an aromatic diamine with flexible ether linkages—4,4’-oxydianiline (ODA)—by a two-step polymerization procedure via soluble poly(amic acid) (PAA) precursors, followed by thermal imidization at elevated temperatures. The developed PI coatings exhibited good comprehensive properties, including glass transition temperatures (Tg) as high as 346.9 °C, measured by dynamic mechanical analysis (DMA), and coefficients of linear thermal expansion (CTEs) as low as 24.6 × 10−6/K in the range of 50–300 °C. In addition, the PI coatings exhibited good adhesion to the fused quartz capillary columns. No cracking, delamination, warpage, or other failures occurred during the 100-cycle thermal shock test in the range of 25–320 °C.

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“…At last, the dimensional stability of the PI films at elevated temperatures were investigated by the TMA measurements and the CTE values of the PI films in the temperature range of 50-250 °C were recorded, as shown in Figure 10 and Table 2. Benzimidazole units have been widely incorporated into the molecular structures of PI films either for decreasing the CTE values of the films [31,32], increasing the modulus of the films [33], increasing the Tg values of the films [34], or increasing the bonding strength with the copper foil [35] due to the strong intermolecular interactions resulting from the formation of the hydrogen bonding for the benzimidazole-containing PI films [36]. At last, the dimensional stability of the PI films at elevated temperatures were investigated by the TMA measurements and the CTE values of the PI films in the temperature range of 50-250 • C were recorded, as shown in Figure 10 and Table 2.…”

Section: Thermal Propertiesmentioning

confidence: 99%

Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates

et al. 2020

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In the current work, a series of black polyimide (PI) films with excellent thermal and dimensional stability at elevated temperatures were successfully developed. For this purpose, two aromatic diamines including 4,4′-iminodianline (NDA) and 2-(4-aminophenyl)-5- aminobenzimidazole (APBI) were copolymerized with pyromellitic dianhydride (PMDA) to afford PIs containing imino groups (–NH–) in the molecular structures. The referenced PI film, PI-ref, was simultaneously prepared from PMDA and 4,4′-oxydianiline (ODA). The introduction of imino groups endowed the PI films with excellent blackness and opaqueness with the optical transmittance lower than 2% at the wavelength of 600 nm at a thickness of 25 μm and lightness (L*) below 10 for the CIE (Commission International Eclairage) Lab optical parameters. Meanwhile, the introduction of rigid benzimidazole units apparently improved the thermal and dimensional stability of the PI films. The PI-d film based on PMDA and mixed diamines (NDA:APBI = 70:30, molar ratio) showed a glass transition temperature (Tg) of 445.5 °C and a coefficient of thermal expansion (CTE) of 8.9 × 10−6/K in the temperature range of 50 to 250 °C, respectively. It is obviously superior to those of the PI-a (PMDA-NDA, Tg = 431.6 °C; CTE = 18.8 × 10−6/K) and PI-ref (PMDA-ODA, Tg = 418.8 °C; CTE: 29.5 × 10−6/K) films.

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Negative in-plane CTE of benzimidazole-based polyimide film and its thermal expansion behavior

Cited by 43 publications

References 22 publications

Transparent and soluble polyimide films containing 4,4′‐isopropylidenedicyclohexanol (Cis‐HBPA) units: Preparation, characterization, thermal, mechanical, and dielectric properties

Transparent and soluble polyimide films containing 4,4′‐isopropylidenedicyclohexanol (Cis‐HBPA) units: Preparation, characterization, thermal, mechanical, and dielectric properties

Preparation and Thermal Evaluation of Novel Polyimide Protective Coatings for Quartz Capillary Chromatographic Columns Operated over 320 °C for High-Temperature Gas Chromatography Analysis

Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates

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