2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2016
DOI: 10.1109/itherm.2016.7517638
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Negative impact of certain adhesive configurations on solder joint reliability of package on package architecture: A comprehensive experimental and numerical study

Shantanu Tripathi
1
,
Ru Han
2
,
Milena Vujosevic
3
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