2010
DOI: 10.1016/j.proeng.2010.09.122
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NEG thin films for under controlled atmosphere MEMS packaging

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Cited by 12 publications
(19 citation statements)
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“…High roughness and porosity induce an increase of both surface gas capacity and sticking probability. The former is simply due to the larger surface area, while the latter is caused by multiple collisions of the impinging molecules inside the surface pores [4,7,12]. Fig.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…High roughness and porosity induce an increase of both surface gas capacity and sticking probability. The former is simply due to the larger surface area, while the latter is caused by multiple collisions of the impinging molecules inside the surface pores [4,7,12]. Fig.…”
Section: Resultsmentioning
confidence: 99%
“…Discrete packages are very critical to assure an excellent hermeticity in many MEMS devices to perform their basic functions properly and to enhance their reliability by keeping these devices away from the harmful external environment [1][2][3][4]. With the technology trend of increased miniaturization of MEMS devices, maintaining the needed vacuum level in such packages for the entire MEMS device life becomes a real technical challenge due to the very high surface to volume ratio [1].…”
Section: Introductionmentioning
confidence: 99%
“…The experimental procedure has already been presented in previous studies [7][8]. It is based on the sealing of samples in a glass ampoule.…”
Section: Outgassing Characterization Methodsmentioning
confidence: 99%
“…A selection among the used materials or thermal treatment before sealing can therefore be considered to reduce their influence on pressure increase inside the cavity. In a second part the possibility of reducing the pressure after sealing is explored through the use of a getter material previously studied by Tenchine [7]. The compatibility between the nature of the released gases and the ability of the getter to chemisorb them is evaluated following the same procedure.…”
Section: Figure 1 Thin Film Packaging Fabrication Processmentioning
confidence: 99%
“…5 Consequently, integrating getter films into the MEMS cavities to obtain and maintain the vacuum has been increasingly studied in the recent years. 6,7 Although some wafer-level packaging processes could allow multiple activation of the getter film, the getter film is usually thermally activated only once after cavity sealing with a background pressure typically in the 10 À3 -10 À1 mbar range. In this respect, it is quite different from the case of thermal activation of getter films used in ultrahigh vacuum chambers.…”
Section: Introductionmentioning
confidence: 99%