Abstract:A setup for an NIR-LCSI instrument is introduced. It is based on a Superluminescence diode (SLD) (wavelength = 1280nm, FWHM = 50nm) and an InGaAs camera with VGA resolution. The paper presents a work in progress. The aim of the research work is to measure the chipping process in a Si wafer saw with high spatial resolution. Hereby the sawing channel inside the silicon block is investigated. The chipping generates a change of the interface topography of the sawing channel. NIR-LCSI will be applied to measure thi… Show more
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