2017 Fifth Berkeley Symposium on Energy Efficient Electronic Systems &Amp; Steep Transistors Workshop (E3S) 2017
DOI: 10.1109/e3s.2017.8246180
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NCFET: Opportunities & challenges for advanced technology nodes

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Cited by 10 publications
(6 citation statements)
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“…An important parameter in the design of NCFETs is capacitance matching. The insulating buffer layer thickness is usually designed to optimize capacitance matching 87,88 ; however, the optimization of this para meter is typically based on a model assuming homogen eous polarization, which is not valid for the multidomain case, in which the NC in the ferroelectric is approx imately independent of the dielectric layer thickness above a certain value. Thus, further device modelling that explicitly considers multidomain gates with mobile domain walls is required 89,90 .…”
Section: Device Implementation Work On Ferroelectric Fetsmentioning
confidence: 99%
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“…An important parameter in the design of NCFETs is capacitance matching. The insulating buffer layer thickness is usually designed to optimize capacitance matching 87,88 ; however, the optimization of this para meter is typically based on a model assuming homogen eous polarization, which is not valid for the multidomain case, in which the NC in the ferroelectric is approx imately independent of the dielectric layer thickness above a certain value. Thus, further device modelling that explicitly considers multidomain gates with mobile domain walls is required 89,90 .…”
Section: Device Implementation Work On Ferroelectric Fetsmentioning
confidence: 99%
“…Importantly, sub60 mV per decade S is usually observed only over a limited range of gate biases, which has been attributed to difficulties in main taining capacitance matching over the entire subthresh old region as well as in the ON state, owing to the fact that the semiconductor capacitance substantially changes from depletion to inversion. Nevertheless, recent reports of enhanced ONstate currents and transconductance in HfO 2 based FinFETs 87,88,100 , as well as the improvements in short channel effects 100,101 , attributed to NC operation, are very encouraging.…”
Section: Device Implementation Work On Ferroelectric Fetsmentioning
confidence: 99%
“…∼0 mV/decade at 300 K), improved on-state drive current at a higher temperature [16,17], superior degree of saturation of output current [18], a low leakage current (∼10 12 A µm −1 or below) at a lower threshold voltage (<0.3 V), and reasonable switching speed (not like NEM relay) [19]. On the other hand, circuit-functionality, reliability, cost, or CMOS compatibility of those novel devices are still lacking, to replace conventional MOSFET [3,6,20]. The asymmetric source/drain structure [21] in TFET, IMOS, and FBFET would cause process complexity.…”
Section: Introductionmentioning
confidence: 99%
“…One reason for this is that the power consumption of the device is difficult to reduce. In traditional MOSFETs, the sub-threshold swing (SS) of the device is limited by the Boltzmann limit, resulting in the chip power consumption failing to reach the expected target [1][2][3][4][5]. To reduce the device power consumption, several novel device models have been proposed to achieve a sub-threshold swing (SS) lower than 60 mV/dec at room temperature.…”
Section: Introductionmentioning
confidence: 99%