Vanadium
dioxide exhibits a sharp temperature-induced structural
change (monoclinic to rutile) that induces a semiconductor-to-metal
transition together with a major change in its electrical properties.
Even though VO2 thin films are a promising candidate for
numerous applications to electronic and energy devices, one of the
greatest challenges toward integration of this material is to precisely
control the transition temperature. Substrate-induced interfacial
effects and dopant-induced isostatic stress combined with excess electron
injection are the main paths used to reduce the temperature of transition.
In this work, we combine metallic doping with tungsten atoms and strain
engineering in VO2 thin films in order to lower the transition
temperature while maintaining a high resistivity contrast. Epitaxial
undoped films are shown to respond to substrate-induced strain by
relaxing with increasing thickness but with a limited reduction of
the transition temperature. In contrast, epitaxial doped films do
not show any dependence on substrate-induced strain but yield a great
reduction of the transition temperature as compared to polycrystalline
relaxed doped films. This temperature shifts down to room temperature
or even close to 0 °C depending on the doping level. This shift
is accompanied by a different morphology of the film as compared to
undoped films. In contrast to undoped VO2 where the substrate-induced
effect is limited to very thin films, combining tungsten doping and
substrate-induced strain allows one to take advantage of the interfacial
effect at any film thickness. Moreover, activation energies below
100 meV and greatly reduced transition temperatures combined with
an electrical contrast still above 2 orders of magnitude make tungsten-doped
VO2 films of strong interest for many devices.