Narrow Conductive Structures with High Aspect Ratios Through Single‐Pass Inkjet Printing and Evaporation‐Induced Dewetting

Abbel, Robert; Teunissen, Pit; Michels, Jasper J.; Groen, W.A.

doi:10.1002/adem.201400339

Cited by 17 publications

(17 citation statements)

References 37 publications

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“…Without meeting both dewetting and solubility requirements conditions simultaneously, the printed lines will either not recede at all or only recede to a certain limit before becoming nonuniform. This effect has also been observed elsewhere . Without the formation of the concave structure, the ink will dewet completely and become discontinuous; however, by confining the ink, the morphology of the line can be maintained until the drying process is complete.…”

Section: Resistance Per Unit Length Resistivity and Sheet Resistancsupporting

confidence: 66%

Printing Silver Conductive Inks with High Resolution and High Aspect Ratio

Chu

Zhang

Tao

2018

Adv Materials Technologies

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Narrow metal lines with low electrical resistance are essential for many printable electronic devices. Printing metal lines of narrower than 10 µm and with a high thickness‐to‐width aspect ratio is very difficult and remains a technical challenge in printable electronics. In this work, by controlling the ink–substrate interaction and ink drying dynamics, 4.6 µm wide inkjet‐printed silver lines are demonstrated with an aspect ratio of 0.7 and an elliptical cross‐section. The silver lines are obtained by jetting a silver nanoparticle‐based ink onto an SU‐8‐coated polyethylene terephthalate substrate to form well‐defined silver lines, and then heating the lines to transform them into high aspect ratio narrow lines through ink dewetting and receding. The simultaneous dissolution and redistribution of SU‐8 by the ink result in a concave structure, which prevents the lines from bulging and allows the lines to become embedded into the SU‐8 film.

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Section: Resistance Per Unit Length Resistivity and Sheet Resistancsupporting

confidence: 66%

Printing Silver Conductive Inks with High Resolution and High Aspect Ratio

Chu

Zhang

Tao

2018

Adv Materials Technologies

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“…[26,43] Although technically drops could be placed 20 µm apart, [44] the spreading of the ink spoils this accuracy. [45] Droplets deposited too close to each other can merge and therefore cause defects in the printed features. By utilizing the substrate pre-structuring, we investigate if the spreading of the ink can be actively suppressed compared to a non-structured surface treatment and whether this approach can be used to further increase the resolution.…”

Section: Inkjet Printing On Pre-structured Substratesmentioning

confidence: 99%

Surface energy patterning for ink-independent process optimization of inkjet-printed electronics

Schlisske¹,

Raths²,

Ruiz‐Preciado³

et al. 2021

Flex. Print. Electron.

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The applicability of inkjet-printed (opto-)electrical devices are hindered by their low lateral resolution, when compared to conventional techniques. The low lateral resolution is mainly caused by the flow and spreading of the functional ink on the substrate, which is determined by the substrate-ink-interaction. Recent apporaches, that confine and controll the spreading have been developed. However, they suffer from low lateral resolution or the usage of physical barriers. The later needs an adjustment of the ink or may contain an overlaid height information. Both cases are not always applicable when fabriacting functional devices. Herein we report the utilization of a surface energy patterning approach based on siloxane self-assembled monolayers. The obtained energetic differences control the flow and suppress the spreading of the ink, without creating the necessity to alter the ink composition. Furthermore this approach leads to an improved structural fidelity and printing resolution of arbitrary shapes. With that, we were able to print silver-and gold-electrodes for organic filedeffect transistors with a channel length of <25 µm, fabricating feature sizes below the footprint of a single drop. The electrical characterization of these transistors revealed that the utilization of this surface energy patterning has no negative influence on the device performance. The introduced approach facilitates the process development and improves the quality and resolution of printed features. This will facilitate the fabrication of high-quality and high resolution printed electronic devices.

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“…[1][2][3][4][5][6] This phenomenon is ubiquitous in nature, such as in the rapid drying of animal feathers, as well as in industrial processes such as aircraft icing, inkjet printing, microfluidics, and spray cooling. 5,[7][8][9][10][11][12][13][14][15][16] In some processes, it is essential to prevent the dewetting phenomenon. For example, in surface coating, the liquid film must remain intact until it has hardened to avoid cracking.…”

Section: Introductionmentioning

confidence: 99%