2007
DOI: 10.1007/s11015-007-0074-5
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Nanotechnology for copper and copper alloys

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Cited by 5 publications
(5 citation statements)
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“…Among the various NMFs, copper foams (Cuf) electrodeposited by DHBT are one of the frontrunners as electrodes for energy applications owing to the abundance, greater electro-migration resistance, lower electrical resistivity, low-cost and versatile nature of the Cu metal. [107][108][109][110] Due to a lower hydrogen overvoltage, dendritic Cufs are more synthetically facile and tuneable than any other NMFs. Additionally, the dependence of electrocatalysts on noble-metals (e.g., Pt, Ir and Ru) in the hydrogen evolution reaction (HER)/oxygen evolution reaction (OER)/oxygen reduction reaction (ORR) limits their large-scale commercial applications, facilitating the scope for the use of porous copper in electrocatalysis and even in the energy storage systems as a cost-effective, stable and scalable alternative.…”
Section: Introductionmentioning
confidence: 99%
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“…Among the various NMFs, copper foams (Cuf) electrodeposited by DHBT are one of the frontrunners as electrodes for energy applications owing to the abundance, greater electro-migration resistance, lower electrical resistivity, low-cost and versatile nature of the Cu metal. [107][108][109][110] Due to a lower hydrogen overvoltage, dendritic Cufs are more synthetically facile and tuneable than any other NMFs. Additionally, the dependence of electrocatalysts on noble-metals (e.g., Pt, Ir and Ru) in the hydrogen evolution reaction (HER)/oxygen evolution reaction (OER)/oxygen reduction reaction (ORR) limits their large-scale commercial applications, facilitating the scope for the use of porous copper in electrocatalysis and even in the energy storage systems as a cost-effective, stable and scalable alternative.…”
Section: Introductionmentioning
confidence: 99%
“…Among the various NMFs, copper foams (Cuf) electrodeposited by DHBT are one of the frontrunners as electrodes for energy applications owing to the abundance, greater electro-migration resistance, lower electrical resistivity, low-cost and versatile nature of the Cu metal. 107–110 Due to a lower hydrogen overvoltage, dendritic Cufs are more synthetically facile and tuneable than any other NMFs. Additionally, the dependence of electrocatalysts on noble-metals ( e.g.…”
Section: Introductionmentioning
confidence: 99%
“…4 shows the microstructure of extruded billets with a diameter of 18 and 20 mm made of CuSn0. The analysis of the microstructure showed that in the conditions of plastic processing using Conform technology a homogeneous, well-developed fine-grained structure is provided [11][12][13].…”
Section: Resultsmentioning
confidence: 99%
“…The temperature‐dependent material parameters E , v , α , H , A 0 $A_{0}$ , Q , n , σ Y $\left(\sigma\right)_{Y}$ of the constitutive model ()–() for polycrystalline copper are taken from the literature [ 27,55,56,58–61 ] and used in the numerical simulations in Section 3.4, 4, and 5.…”
Section: Modeling and Simulationmentioning
confidence: 99%