Nanostructure and mechanical behavior of metastable Cu–Cr thin films grown by molecular beam epitaxy

Harzer, Tristan Philipp; Djaziri, Soundès; Raghavan, R.; Dehm, Gerhard

doi:10.1016/j.actamat.2014.10.013

Cited by 56 publications

(19 citation statements)

References 65 publications

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“…Details of the procedure for preparing the electron transparent cross-section lamellae are provided elsewhere [25].…”

Section: Structural Characterizationmentioning

confidence: 99%

“…From a technological perspective, it is desirable to obtain an optimal composition of a Cu-Cr alloy to improve the strength and oxidation resistance of copper used universally in applications exploiting the electrical properties of copper, while demanding high strengths. While a few studies have investigated the extension of miscibility by using rapid quenching and severe plastic deformation and forming metastable Cu-Cr alloys, a more thorough recent study has indicated that an optimal composition is indeed achievable [25]. These ideas and inputs lead to the motivation to study the role of compositional architecture, in other words, design of the nanolayering vis-à-vis nano-scaled alloying of the films of the same overall composition.…”

Section: Introductionmentioning

confidence: 97%

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Comparing small scale plasticity of copper-chromium nanolayered and alloyed thin films at elevated temperatures

et al. 2015

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“…Details of the procedure for preparing the electron transparent cross-section lamellae are provided elsewhere [25].…”

Section: Structural Characterizationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 97%

Comparing small scale plasticity of copper-chromium nanolayered and alloyed thin films at elevated temperatures

et al. 2015

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“…Most metallic films are prepared by costly vacuum-based deposition processes, such as chemical vapor deposition [2,3], thermal or electron beam evaporation [4], and molecular beam epitaxy [5], which usually require costly and sophisticated equipment with limited throughput.…”

Section: Introductionmentioning

confidence: 99%

Light welding nanoparticles: from metal colloids to free-standing conductive metallic nanoparticle film

Chen

Yang

et al. 2016

Sci. China Mater.

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Bottom-up assembly of nanostructured thin films could offer an alternative low-cost approach to electronic thin films. However, such solution-processed thin films are often plagued by excessive inter-particle resistance and only exhibit limited current delivering capability. Here, we report a novel approach to fabricate highly conductive free-standing metallic thin film, accomplished by combining interfacial self-assembly of nanoparticles (NPs) and a light welding process. We found that light from a xenon lamp can weld adjacent Ag and Au NPs assembled at the water-air interface, forming a highly interconnected, free-standing metallic thin film structure with excellent electrical transport properties. With such a unique structure, the resultant thin metallic films show not only high flexibility and robustness, but also high conductivity comparable to bulk metallic thin films. Our studies offer a low-cost, room-temperature, and solution-processable approach to highly conductive metallic films. It can significantly impact solution-processable electronic and optoelectronic devices.

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“…There does not exist any Cu-W compound in its equilibrium phase diagram. Actually, for the most studied immiscible binary alloyed films (such as Cu-W [101], Cu-Cr [102], and Cu-Ta [103]), nonequilibrium NS alloys, i.e., supersaturated solid solutions (SSSs), can be obtained by MS. Compared with the elemental (Cu) thin films, it is normally expected that the marked solute segregation that alters GB characters could occur and the solute drag effect could yield smaller grains [8,12], both of which affect the propensity of nanotwin formation in binary Cu-based thin films.…”

Section: Alloying Effects On Microstructure and Mechanical Propertiesmentioning

confidence: 99%

Grain Boundary Segregation in Nanocrystructured Metallic Materials

Zhang¹,

Liu²,

Sun³

2017

Study of Grain Boundary Character

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The aim of this chapter is to shed light on the effects of grain boundary segregation on microstructural evolution in nanostructured metallic materials as well as on their mechanical properties. Several key topics will be covered. First, a brief explanation of mechanical stress-driven grain growth in nanostructured Al, Ni, and Cu thin films will be provided in terms of a deformation mechanism map. It will become clear that the excess energy of grain boundaries enable the nanostructured metals to suffer from significant microstructure evolution via dislocation-boundary interactions during plastic deformation even at room temperature. Manipulation of grain boundary structures/properties via dopants segregation at grain boundaries to inhibit grain coalescence associated with remarkably enhanced mechanical properties is then discussed in three representative binary Cu-based systems, i.e., Cu-Zr, Cu-Al, and Cu-W. This is finally followed by a summary of this chapter.

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Nanostructure and mechanical behavior of metastable Cu–Cr thin films grown by molecular beam epitaxy

Cited by 56 publications

References 65 publications

Comparing small scale plasticity of copper-chromium nanolayered and alloyed thin films at elevated temperatures

Comparing small scale plasticity of copper-chromium nanolayered and alloyed thin films at elevated temperatures

Light welding nanoparticles: from metal colloids to free-standing conductive metallic nanoparticle film

Grain Boundary Segregation in Nanocrystructured Metallic Materials

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