2010
DOI: 10.1002/adma.201002465
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Nanoscopic Patterned Materials with Tunable Dimensions via Atomic Layer Deposition on Block Copolymers

Abstract: Selective self‐limited interaction of metal precursors with self‐assembled block copolymer substrates, combined with the unique molecular‐level management of reactions enabled by the atomic layer deposition process, is presented as a promising controllable way to synthesize patterned nanomaterials (e.g., Al2O3 see Figure, TiO2, etc.) with uniform and tunable dimensions.

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Cited by 266 publications
(387 citation statements)
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“…This approach has been used to create nanopatterned metal oxide lines by infiltrating ALD precursors into layered bulk co-polymer films. 43 …”
Section: Ald and Vapor Infusion Into Polymersmentioning
confidence: 99%
“…This approach has been used to create nanopatterned metal oxide lines by infiltrating ALD precursors into layered bulk co-polymer films. 43 …”
Section: Ald and Vapor Infusion Into Polymersmentioning
confidence: 99%
“…Peng et al [ 111 ] were the fi rst to employ an ALD derived process (in later publications coined sequential infi ltration synthesis or SIS) with an asymmetric forming PS-b -PMMA BCP system consisting of either nanoposts or cylinders to fabricate metal oxide arrays. As depicted in Figure 9 and Figure 10 , the SIS process involves initial exposure of the PS-b -PMMA fi lms to precursor molecules (trimethyl aluminum or titanium tetrachloride/water) possessing an affi nity to the reactive PMMA microdomain.…”
Section: Sequential Infi Ltration Synthesis Of Block Copolymersmentioning
confidence: 99%
“…e-h) Reproduced with permission. [ 118 ] [53,55,60,80,97] Co posts, [58] Co nanorings, [61] Fe posts, [63] Cr posts [59,73] aligned Al and Au nanowires, [64] Ge nanowires, [68] Al 2 O 3 dots, [66] Ti/Pt dots [85] On-chip etch mask, [44] ferromagnetic nanorings, [61] carbon nanotube growth, [63] metal nanodot memory device, [73] triboelectric generator, [62] resistive switching nanodevice, [85] plasmonic, [97] Atomic layer deposition Al 2 O 3 line and hole spacer, [94] Al 2 O 3 wires and posts [95,96] On-chip etch mask [96] Sequential infi ltration synthesis Al 2 O 3 posts, [111 , 116-120 , 122] Al 2 O 3 wires, [111][112][113][114][115][116] TiO 2 wires, [111] SiO 2 posts, [112] SiO 2 wires, [112] W wires, [112] ZnO posts, [116] ZnO wires [112,116] On-chip etch mask, [113-115 , 117,118] SIS procedure for PS block selectivity, [116] superhydrophobicity, [117,118] anti-refl ec...…”
Section: Reviewmentioning
confidence: 99%
“…After infiltration, the BCP template was removed by O 2 RIE or by heating the film to 500 • C so that Al 2 O 3 lines, which replicated the BCP microdomains, remained [50]. Control over the width of the Al 2 O 3 mask was achieved by varying the ALD cycle counts [50]. The SIS process improved the etching resistance of the PMMA domains by a factor of 37 by using HBr gas for the RIE [52].…”
Section: (A) Ps-b-pi and Ps-b-pbmentioning
confidence: 99%