Nanoscopic Characterization and Mechanism Analysis of LiTaO3/Si Interfaces Prepared by Mo/Au Nanoadhesive Layers for Applications in LiTaO3-Based Devices
Kang Wang,
Jiao Fu,
Yongqiang Ji
et al.
Abstract:To improve the temperature compensation of LiTaO 3 -based devices, room-temperature bonding of LiTaO 3 and Si wafers was performed in atmospheric air using Mo/Au (∼21.6 nm/ ∼78.6 nm) nanoadhesive layers. TEM observations show that each of the Mo/Si, Au/Mo, Au/Au, and Mo/LiTaO 3 interfaces is tightly bonded without any defects, and after surface activation, the thickness (1.6 nm) of the amorphous layer formed on the surface of LiTaO 3 is lower than that (3.3 nm) on the surface of Si. Due to the adsorption energ… Show more
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