2016
DOI: 10.20944/preprints201608.0151.v1
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Nanoscale Silicon Waveguide Based Thermo-Optic Sensor Using a Compact Mach-Zehnder Interferometer

Abstract: A compact Mach-zehnder interferometer with a novel design of directional couplers and a phase shifter has been presented as a thermo-optical sensor. With the aim of reducing device size to micro and nano dimension silicon-on-insulator technology was employed. That allowed miniaturization of device size through the reduction of its cross sectional area to 0.066 μm 2 and the radius of curvature of both the arms of the directional coupler and S-bends of the phase shifter to 5 μm and C-bends to 3 μm. These nano si… Show more

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Cited by 4 publications
(4 citation statements)
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References 17 publications
(18 reference statements)
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“…To minimize heat loss and spreading of heat to reference arm and to other parts, a trench surrounds the modulating arm, similarly to our earlier works (see Refs [19,34,35]). The implementation of this design significantly helps prevent heat spreading and loss by over 90 % as the heat required to drive the switch is directly linked to the device size.…”
Section: Thermo-optic Heatersmentioning
confidence: 98%
“…To minimize heat loss and spreading of heat to reference arm and to other parts, a trench surrounds the modulating arm, similarly to our earlier works (see Refs [19,34,35]). The implementation of this design significantly helps prevent heat spreading and loss by over 90 % as the heat required to drive the switch is directly linked to the device size.…”
Section: Thermo-optic Heatersmentioning
confidence: 98%
“…To minimize heat loss and spreading of heat to reference arm and to other parts, a trench is created around the modulating arm as described earlier [7,20,21]. The implementation of this design significantly helps prevent heat spreading and minimize loss by over 90% as the heat required to drive the switch is directly linked to the device size.…”
Section: Principle Of Operation Of the Devicementioning
confidence: 99%
“…Beyond any possible doubt, Silicon is a fundamental material of utmost importance for both applicative purposes and pure science [ 1 ]. In this context, recent research activity shows a growing interest in the area of hybrid, silicon-based, molecular electronics, which is driven by possible technological applications such as biosensors, photovoltaic cells, and optoelectronic devices [ 2 , 3 , 4 , 5 , 6 ]. Different methodologies exist for the preparation of hybrid silicon-based interfaces, relying on the covalent grafting of organic molecules, and these are generally based on ultra-high vacuum (UHV) depositions [ 7 , 8 , 9 ], wet chemistry exploiting UV curing [ 10 , 11 ], electrochemical-based methodologies [ 12 , 13 ].…”
Section: Introductionmentioning
confidence: 99%