Abstract:The model of surface topography evolution during ion bombardment is developed. In contrast to the conventional approach, surface topography is considered a superposition of microscopic and submicron contours. The sputtering yield is treated as a function of the bombardment angle and surface deviation from the microscopic contour in points of primary ion implantation and secondary ion ejection. These improvements, subject to the surface inclination in the implantation point, result in two expressions, one of wh… Show more
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