2022
DOI: 10.1039/d1dt03736f
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Nanoscale Li, Na, and K ion-conducting polyphosphazenes by atomic layer deposition

Abstract: Solid state batteries (SSBs), and corresponding solid-state electrolytes (SSEs), have been proposed to address both dimensional restrictions and safety concerns associated with liquid electrolyte batteries. Atomic layer deposition (ALD) is...

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Cited by 8 publications
(2 citation statements)
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“…At the top of this list is lithium phosphorus oxynitride, LiP x O y N z (LiPON), due to its many advantages such as its relatively high ionic conductivity, good electrochemical stability against Li metal, and low enough electronic conductivity. In addition to the aforementioned properties, thin LiPON films are transparent and can be deposited as part of flexible TFBs. , So far, a variety of advanced gas-phase thin-film deposition techniques have been adopted for the growth of LiPON films on planar substrates, including sputtering, pulsed laser deposition (PLD), metal–organic chemical vapor deposition (CVD), and atomic layer deposition (ALD). , The line-of-sight operation mode in both sputtering , and PLD makes them unsuitable for complex 3D geometries. On the other hand, CVD techniquesespecially ALD, which is based on self-saturating surface reactionsare anticipated to yield uniform and conformal coatings on complex 3D structures with large ARs .…”
mentioning
confidence: 99%
“…At the top of this list is lithium phosphorus oxynitride, LiP x O y N z (LiPON), due to its many advantages such as its relatively high ionic conductivity, good electrochemical stability against Li metal, and low enough electronic conductivity. In addition to the aforementioned properties, thin LiPON films are transparent and can be deposited as part of flexible TFBs. , So far, a variety of advanced gas-phase thin-film deposition techniques have been adopted for the growth of LiPON films on planar substrates, including sputtering, pulsed laser deposition (PLD), metal–organic chemical vapor deposition (CVD), and atomic layer deposition (ALD). , The line-of-sight operation mode in both sputtering , and PLD makes them unsuitable for complex 3D geometries. On the other hand, CVD techniquesespecially ALD, which is based on self-saturating surface reactionsare anticipated to yield uniform and conformal coatings on complex 3D structures with large ARs .…”
mentioning
confidence: 99%
“…45,46 Device conformality is most widely achieved through vapor phase deposition techniques (i.e., CVD, ALD, etc), but can also include liquid electrochemical deposition. 41,42,[47][48][49][50][51] Despite the success of free-standing AAO, it remains mostly incompatible with standard microfabrication techniques due to its brittleness. Oh and Thompson demonstrated integration of AAO on Si substrates through the use of a valve-metal interlayer.…”
mentioning
confidence: 99%