Nanopatterned ferroelectrics for ultrahigh density rad-hard nonvolatile memories.

Abstract

Radiation hard nonvolatile random access memory (NVRAM) is a crucial component for DOE and DOD surveillance and defense applications. NVRAMs based upon ferroelectric materials (also known as FERAMs) are proven to work in radiation-rich environments and inherently require less power than many other NVRAM technologies. However, fabrication and integration challenges have led to state-of-the-art FERAMs still being fabricated using a 130nm process while competing phase-change memory (PRAM) has been demonstrated with a 20nm process.[1] Use of block copolymer lithography is a promising approach to patterning at the sub-32nm scale [2], but is currently limited to self-assembly directly on Si or SiO 2 layers. Successful integration of 3 ferroelectrics with discrete and addressable features of ∼15-20nm would represent a 100-fold improvement in areal memory density and would enable more highly integrated electronic devices required for systems advances. Towards this end, we have developed a technique that allows us to carry out block copolymer self-assembly directly on a huge variety of different materials and have investigated the fabrication, integration, and characterization of electroceramic materials-primarily focused on solution-derived ferroelectrics-with discrete features of ∼20nm and below. Significant challenges remain before such techniques will be capable of fabricating fully integrated NVRAM devices, but the tools developed for this effort are already finding broader use. This report introduces the nanopatterned NVRAM device concept as a mechanism for motivating the subsequent studies, but the bulk of the document will focus on the platform and technology development. 4 AcknowledgmentThe authors would like to extend their gratitude to