Nanoparticle removal from substrates with pulsed-laser induced plasma and shock waves

Cetinkaya, Çetin; Vanderwood, Richard; Rowell, Matthew

doi:10.1163/156856102320256846

Cited by 49 publications

(34 citation statements)

References 18 publications

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“…A 25 mm diameter, 100 mm focal length lens with a 1064 nm speci c antire ective coating was used to converge the laser beam. A shorter focal length lens would be more ideal due to the high quality of the plasma burst produced [11,12], but wafer positioning requirements demanded a larger focal length lens.…”

Section: Experimental Methods and Setupmentioning

confidence: 99%

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Efficiency studies of particle removal with pulsed-laser induced plasma

Hooper¹,

Cetinkaya²

2003

Journal of Adhesion Science and Technology

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The detachment and removal of micro-and nanoparticles from surfaces is of importance in many industries. The cleaning of silicon wafers is of great interest in the semiconductor, microelectronics, and optics industries. The development and adoption of dry, rapid, non-contact, and non-damaging particle removal technologies is a critical process. The proposed laser-induced plasma (LIP) removal technique is a novel method for detaching and removing ne particles from substrates. The current technique is a dry, non-contact method that takes advantage of the strong shock wavefront from expanding plasma, created by focusing a laser pulse in air above the substrate. The transient pressure eld acts on the target particles to produce a rotational moment and a rolling mode of detachment from the substrate. In the current study, the LIP removal technique is employed repeatedly to remove particles over an area of a silicon wafer, and a systematic ef ciency study for the removal effectiveness is performed. A Q-switched Nd:YAG pulsed laser operating at 1064 nm with a 370 mJ pulse energy and 5 ns pulse length is used in experiments. 0.99 ¹m diameter silica spheres and 3.063 ¹m diameter polystyrene spheres were successfully detached and removed with no substrate damage. The removal ef ciency at various gap distances between plasma core and substrate is determined and reported. This work is the rst laboratory demonstration of the LIP technique over an extended area. The reported results substantiate the LIP removal technique as a serious option for particle detachment and removal from extended areas.

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Section: Experimental Methods and Setupmentioning

confidence: 99%

“…The laser-induced plasma technique is a novel method for particle detachment and removal using the pressure eld created by LIP [10][11][12]. The current experimental set-up is depicted in Fig.…”

Section: Laser-induced Plasmamentioning

confidence: 99%

Efficiency studies of particle removal with pulsed-laser induced plasma

Hooper¹,

Cetinkaya²

2003

Journal of Adhesion Science and Technology

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“…Among various techniques to remove sub-100 nm particles from solid substrates, the laser shock cleaning (LSC) process based on laser-induced breakdown (LIB) of air and plasma formation has attracted substantial attention as the process demonstrated strong potential to remove nanoscale particles from silicon wafers [5][6][7][8]. Recently, removal of polystyrene (PS) particles as small as 10 nm in diameter was reported [8].…”

Section: Introductionmentioning

confidence: 99%

Enhancement of cleaning efficiency by geometrical confinement of plasma expansion in the laser-shock cleaning process for nanoscale contaminant removal

Jang

Lee³

et al. 2009

SPIE Proceedings

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It has been shown that the laser shock cleaning (LSC) process is effective for removing nanoscale particles from solid surfaces and thus has various potential applications in microelectronic manufacturing. In this work, we propose a simple method to amplify the shock wave intensity generated by laser-induced breakdown (LIB) of air. The suggested scheme employs a plane shock wave reflector which confines the plasma expansion in one direction. As the half of the LIBinduced shock wave is reflected by the reflector, the intensity of the shock wave propagating in the opposite direction is increased significantly. Accordingly, the enhanced shock wave can remove smaller particles from the surface than the existing LSC process. The LSC process under geometrical confinement is analyzed both theoretically and experimentally. Numerical computation of the plasma/shock behavior shows about two times pressure amplification for the plane geometry. Experiments confirm that the shock wave intensity is enlarged by the effect of geometrical confinement of the plasma and shock wave. The result of cleaning tests using polystyrene particles demonstrates that the particle removal efficiency increases by the effect of geometrical confinement.

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“…The use of the short-pulsed laser based direct irradiation process has been proposed as an alternative means for particle removal (Zapka et al, 1991;Lee et al, 1991;Cetinkaya et al, 2000Cetinkaya et al, , 2002. In this approach, the acceleration of the particles due to substrate thermoelastic expansion is utilized to break the particle-substrate adhesion bond.…”

Section: Introductionmentioning

confidence: 99%

Nanoparticle Removal Using Laser-Induced Plasma Shock Waves

Peri

Varghese

Zhou

et al. 2007

Particulate Science and Technology

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Removal of sub-100 nm particles from substrates such as wafers and photo masks is an essential requirement in semiconductor, microelectronics, and nanotechnology applications. The proposed laser-induced plasma (LIP) based approach is an effective technique for removal of sub-100 nm particles, as the minimum tolerable particle on the substrates shrinks to sub-100 nm levels with each technological node. In the current study, our progress in sub-100 nm particle removal is reviewed, and the results of the kinetic theory simulations conducted to understand the dynamics of the gas molecule-nanoparticle interactions excited by the shock front are discussed. It is shown from the simulations and experiments that particles as small as sub-100 nm can be successfully detached. To explain possible mechanisms for the nanoparticle detachment in nanoscale, the concepts of rolling resistance moment and rocking motion are utilized as novel detachment mechanisms. The pressure experiments illustrate that the peak pressure levels achieved with the LIP shock wave fields are below damage thresholds of most substrate materials. The potential of the proposed approach as a practical noncontact, dry, fast, and damage-free method for removal of sub-100 nm particles is discussed.

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Nanoparticle removal from substrates with pulsed-laser induced plasma and shock waves

Cited by 49 publications

References 18 publications

Efficiency studies of particle removal with pulsed-laser induced plasma

Efficiency studies of particle removal with pulsed-laser induced plasma

Enhancement of cleaning efficiency by geometrical confinement of plasma expansion in the laser-shock cleaning process for nanoscale contaminant removal

Nanoparticle Removal Using Laser-Induced Plasma Shock Waves

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