Nanoparticle gas phase electrodeposition: Fundamentals, fluid dynamics, and deposition kinetics

Schlag, Leslie; Isaac, Nishchay A.; Nahrstedt, Helene; Reiprich, Johannes; Ispas, Adriana; Stauden, Thomas; Pezoldt, Joerg; Bund, Andreas; Jacobs, Heiko O.

doi:10.1016/j.jaerosci.2020.105652

Cited by 2 publications

(9 citation statements)

References 45 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Electric Field Computation: Done in Comsol with electrical currents model, top of resist was floating parameter, boundary conditions for potential drop were taken from literature [17] (previous own publication).…”

Section: Methodsmentioning

confidence: 99%

“…Five adjustable key parameters are the spark discharge power, the transport gas flow rate, the flash lamp power, the microlens size which in turn is adjusted by the patterned insulator on the substrate and substrate bias. Spark power and transport gas flow rate work in a strong interplay which affects mass deposition rate and morphology [ 17 ] of microfilms with tailored morphology. Different from flat films, the influence on the formation of tailored vias is reported in this study.…”

Section: Methodsmentioning

confidence: 99%

“…The resulting deposition current consists of both species gas ions and charged nanoparticles. [ 17 ] The patterned resist forms an electrodynamic lens array. High‐mobility nitrogen ions arrive first, charge the resist positive and create a pillow on which subsequent positively charged carriers (nitrogen ions and charged nanoparticles, ratio 50…100:1 [ 17 ] ), are deflected until they reach the charge dissipating biased substrate through the openings in the resist.…”

Section: Methodsmentioning

confidence: 99%

“…Localized growth by gas‐phase electrodeposition could offer the possibility to selectively decrease the diameter of the via interconnect with the implementation of a surrounding airgap. In this process, metallic nanoparticles are generated in a spark discharge, transported to the substrate by a gas flow, and can subsequently be deposited into layers [ 17 ] or localized structures. [ 13–15,18–20 ]…”

Section: Introductionmentioning

confidence: 99%

“…Localized growth by gas-phase electrodeposition could offer the possibility to selectively decrease the diameter of the via interconnect with the implementation of a surrounding airgap. In this process, metallic nanoparticles are generated in a spark discharge, transported to the substrate by a gas flow, and can subsequently be deposited into layers [17] or localized structures. [13][14][15][18][19][20] While the benefits of material conservation, size reduction through lensing, and surrounding airgaps are beneficial, the process of gas phase electrodeposition has so far been limited by less electrical conductance.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Self‐Aligning Metallic Vertical Interconnect Access Formation through Microlensing Gas Phase Electrodeposition controlling Airgap and Morphology

Schlag

Isaac

Hossain

et al. 2022

Adv Elect Materials

Self Cite

View full text Add to dashboard Cite

This publication reports self‐aligning metallic via microlensing gas phase electrodeposition formation. Key operational parameters to fabricate vertical ruthenium and rhodium interconnects (via) with a diameter of 100 nm are discussed. Moreover, airgaps are implemented during the deposition process, which utilizes spark discharge to generate a flux of charged nanoparticles. An inert gas flow transports the nanoparticles through a reactor chamber close to the target substrate. The substrate uses a pre‐patterned resist with openings to a silicon/silicon dioxide/metal stack to direct the deposition of the nanoparticles to form localized self‐aligning vertical interconnects. Five process parameters were identified, which impact the morphology and conductance of the resulting interconnects: spark discharge power, gas flow rate, microlens via dimensions, substrate surface potential, and in situ flash lamp power. This parameter set enables a controlled adjustment of the via interconnect morphology and its minimum feature size. Gas flow rate in combination with spark discharge power contribute significantly to the morphology of the interconnect. Spark power and microlens via dimensions have the largest influence on the surface potential of the insulating resist cover, which enables a localized microlensing gas phase electrodeposition of a via with a controlled ratio between conducting diameter and airgap.

show abstract

Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%