2011
DOI: 10.1002/adma.201004656
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Nanoparticle‐Enabled Selective Electrodeposition

Abstract: Electrodeposition of a material onto a conducting substrate with strong adhesion and exceptional uniformity through the use of platinum nanoparticles as the seed layer is reported. The use of platinum nanoparticles also creates an optimum voltage range to selectively electroplate various metals on substrate into areas seeded with the nanoparticles.

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Cited by 22 publications
(21 citation statements)
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“…Recently, biomimetic and spatially tailored microenvironments have been synthesized in 3D structures. Current methods have been developed to create structural, mechanical, or biochemical gradients, relying on material science, bioprinting, microscale engineering, and microfluidic techniques . Although each of the previous methods can control 3D gradient formation, the combination of relevant architectures by porosity guidance with structural gradients has not been achieved.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, biomimetic and spatially tailored microenvironments have been synthesized in 3D structures. Current methods have been developed to create structural, mechanical, or biochemical gradients, relying on material science, bioprinting, microscale engineering, and microfluidic techniques . Although each of the previous methods can control 3D gradient formation, the combination of relevant architectures by porosity guidance with structural gradients has not been achieved.…”
Section: Introductionmentioning
confidence: 99%
“…The electro-crystallisation can be readily manipulated by the interplay between the crystal growth rate and the mass transport rate via the control of deposition potential without changing the reactant concentration222324. Ye et al 25.…”
mentioning
confidence: 99%
“…The sulfamate solutions are often preferred due to low deposited film stress, low sulfur content in the deposited metals, and the generally good mechanical properties of the Ni. Additionally, the high current efficiency of the bath typically allows for high deposition rates, permitting the rapid deposition of thick, low-stressed films 16 17 . The NiO layer formed by plasma oxidation on Ni substrate is employed to fabricate Ni/NiO/Ni ReRAM device, which shows a unipolar resistive switching property.…”
mentioning
confidence: 99%