Nanoparticle chemisorption printing technique for conductive silver patterning with submicron resolution

Yamada, Toshikazu; Fukuhara, Katsuo; Matsuoka, Ken; Minemawari, Hiromi; Tsutsumi, Jun; Fukuda, Nobuko; Aoshima, Keisuke; Arai, Shunto; Makita, Yuichi; Kubo, Hitoshi; Enomoto, Takao; Togashi, Takanari; Kurihara, Masato; Hasegawa, Tatsuo

doi:10.1038/ncomms11402

Cited by 107 publications

(95 citation statements)

References 41 publications

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“…Flexible electronic devices have attracted extensive attention owing to their widespread application. One of the key areas under rapid development is wearable electronics . However, when it comes to applications with unconventional interfaces, traditional substrates result in a problem of mechanical mismatch .…”

Section: Applicationsmentioning

confidence: 99%

Strategic Design of Clay‐Based Multifunctional Materials: From Natural Minerals to Nanostructured Membranes

Zhou

LaChance

Smith

et al. 2019

Adv Funct Materials

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Nature not only carefully prepares ingenious raw materials but also continuously inspires and guides human beings to create a wide variety of intelligent materials. As the most abundant mineral resource on earth, clay minerals are no longer synonymous with ceramics and cements. Many natural clay minerals can be exfoliated into single-or few-layered nanosheets with exquisite physicochemical properties, which can be reassembled into functional membranes with a macroscopic controllable size and microscopic ordered structure. They are thus used in many fields including chemistry, biology, energy, and environmental science. Strategic design represents one of the key processes to enhance the value of clay minerals and broaden their applications. In this work, the three frequently used approaches of exfoliation are highlighted and the six routes of assembly including casting, dip-coating, spray coating, vacuum filtration, electrophoretic deposition, and 3D printing are compared. The corresponding principles and advantages are summarized. Representative applications of clay-based multifunctional membranes in protection, separation, responsiveness, flexible electronics, and energy conversion are presented. The challenges and future perspectives of the claybased multifunctional membranes are discussed.

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Section: Applicationsmentioning

confidence: 99%

Strategic Design of Clay‐Based Multifunctional Materials: From Natural Minerals to Nanostructured Membranes

Zhou

LaChance

Smith

et al. 2019

Adv Funct Materials

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“…An aspect ratio of 0.7 was obtained for the Ag line shown in Figure d, which is only 3 µm wide at the upper exposed flat area and 4.6 µm wide at its widest section. This line width is much smaller than the typical values of 10–50 µm from regular inkjet printing, and is achieved without requiring prepatterning of the substrate to guide ink flow or to extract extra ink . It must also be noted that this aspect ratio is very high for printed metal lines.…”

Section: Resistance Per Unit Length Resistivity and Sheet Resistancmentioning

confidence: 92%

Printing Silver Conductive Inks with High Resolution and High Aspect Ratio

Chu

Zhang

Tao

2018

Adv Materials Technologies

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Narrow metal lines with low electrical resistance are essential for many printable electronic devices. Printing metal lines of narrower than 10 µm and with a high thickness‐to‐width aspect ratio is very difficult and remains a technical challenge in printable electronics. In this work, by controlling the ink–substrate interaction and ink drying dynamics, 4.6 µm wide inkjet‐printed silver lines are demonstrated with an aspect ratio of 0.7 and an elliptical cross‐section. The silver lines are obtained by jetting a silver nanoparticle‐based ink onto an SU‐8‐coated polyethylene terephthalate substrate to form well‐defined silver lines, and then heating the lines to transform them into high aspect ratio narrow lines through ink dewetting and receding. The simultaneous dissolution and redistribution of SU‐8 by the ink result in a concave structure, which prevents the lines from bulging and allows the lines to become embedded into the SU‐8 film.

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“…Recently, increased attention on the additive processes has been paid for printed electronics (PE) technology, due to the corrosive chemicals and environment pollution in subtractive processes [1,2]. However, fine-line and electrical conductivity are the critical requirements for additive processes in printed electronics technology because the performance and reliability of an electric device depend on the scale and conductivity of the pattern [3,4]. For instance, Fujikura Company printed 30 μm Ag conductive paste patterns on polyethylene telephthalate (PET) film with resistance of 40 μΩ·cm by gravure offset printing technology [5].…”

Section: Introduction mentioning

confidence: 99%

Additive Fine-Line Circuit Process through Catalyst Induced Copper Electroless Plating

Lin¹,

Wang²,

Lin³

et al. 2020

JMEA

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To response the demand for fine line in electronic products, additive manufacturing process integrated printing techniques and deposited methods to reach fine line circuit, with the merits of reduced material wastage, low fabrication costs, and mass production advantage capability. Recently, we have developed additive process in fabricating circuit on flexible substrate through catalyst induced copper electroless deposition (ELD) method. The additive processes that integrated printing, activation, and metallization were applied to produce fine-line circuit with 5 μm line width. The sample with ultraviolet (UV) activation shows better conductive property in comparison with the sample without activation after electroless deposited process. Accordingly, the results indicated that the reaction of catalyst induced electroless copper plating strongly depends on UV activation. The fine-line circuit exhibits a narrow line width circuit (around 5 μm), lower resistance (6.2 μΩ·cm), and mass production with low pollution in comparison with lithographic processes (with photoresist and acid pollution) with a high throughput system (R 2 R system) for the applications of double side flexible printed circuit board (FPCB).

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Nanoparticle chemisorption printing technique for conductive silver patterning with submicron resolution

Cited by 107 publications

References 41 publications

Strategic Design of Clay‐Based Multifunctional Materials: From Natural Minerals to Nanostructured Membranes

Strategic Design of Clay‐Based Multifunctional Materials: From Natural Minerals to Nanostructured Membranes

Printing Silver Conductive Inks with High Resolution and High Aspect Ratio

Additive Fine-Line Circuit Process through Catalyst Induced Copper Electroless Plating

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