Nanometer scale electron beam lithography in inorganic materials

Abstract

Nanometer scale holes and lines have been produced directly in calcium fluoride, aluminium oxide, and magnesium oxide by an intense beam of electrons. There is a threshold beam current density for drilling, and the variation of this with voltage has been studied. Observations using electron energy loss spectroscopy have confirmed that metallic aluminium is produced during the drilling of aluminium oxide. Aluminium oxide may be drilled when in contact with the aluminium substrate, which remains undrilled.

Nanocatalysis: Mature Science Revisited or Something Really New?

“…It is, however, extremely limited in producing large-surface-area materials and is thus merely suitable for producing model systems. [90][91][92] In combination with microstructured reactors and in catalytic applications that are not intended for the production of materials (e.g., lab-on-a-chip sensors [93] ) such techniques will, however, be of great significance.…”

Does In form In-rich clusters in InGaN quantum wells?

“…Electron-beam damage of inorganic materials in an electron microscope can be a complex process and the damage mechanism for strained thin layers of InGaN is not yet known. In some inorganic materials, there appears to be a threshold electron beam current density for damage to occur, below which there appears to be little or no damage [24,25]. If InGaN behaves in this way then Gerthsen and Kisielowski may be correct that damage-free electron micrographs of this material can be recorded.…”

Femtosecond Electron Imaging and Spectroscopy

“…Dose-rate dependence is commonly observed for inorganic materials where the dose rate (electron or X-ray fluence) can be relatively high because of the lower radiation sensitivity. There can even be a dose-rate threshold below which no damage is observable (Salisbury et al, 1984;Jiang & Spence, 2012). Dose-rate dependence is not usually observed for organic materials, except in an aqueous environment where longer-range radical diffusion contributes secondary damage (Cherezov et al, 2002) or at low temperatures where diffusion is slow (Egerton & Rauf, 1999).…”