Abstract:We present an optoacoustic method to non-destructively measure the average dimensions of a periodic array of simple structures with aspect ratios greater than 10:1, which are inaccessible to AFM techniques. The technique that we describe could be used as the basis of an inline metrology tool for wafer inspection. The samples examined were test structures with high precision lithographically defined lines of silicon dioxide deposited on a silicon substrate. The thickness of the silicon dioxide was around 400 nm… Show more
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