Nanomechanical Responses of an Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium

Microstructural and Mechanical Characterization of Cu/Sn Slid Bonding Utilizing Co as Contact Metallization Layer

“…However, it has to be considered that the mechanical properties of the Cu 3 Sn and Cu 6 Sn 5 strongly depend on the crystal orientation [7,12,14,65]. Besides, the strain rate can considerably affect the Young's modulus, elastic modulus and hardness values [93,94]. In the current study, the elastic modulus, Young's modulus, and hardness of Cu 6 Sn 5 were found to increase as the Co content in the Cu 6 Sn 5 IMC increases.…”

Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

“…The magnified cross-sectional images given in Figure 10 a,b indicate that, for Cu 6 Sn 5 /Cu 3 Sn, the main crack propagated mostly within the upper Cu 6 Sn 5 , while as to (Cu,Ni) 6 Sn 5 /(Ni,Cu) 3 Sn 4 , the crack passed along the interface between (Cu,Ni) 6 Sn 5 and (Ni,Cu) 3 Sn 4 . This inconsistency could be referred to geometrical discontinuity and mechanical discontinuity of the bi-layer IMCs, sketched in Figure 10 c. With respect to Cu 6 Sn 5 /Cu 3 Sn, the E/H values for Cu 6 Sn 5 (18.84) and Cu 3 Sn (22.22) [ 12 ] did not diverge too much, therefore the crack propagated within Cu 6 Sn 5 , which showed scallop appearance and exhibited many stress concentration sites. In contrast, a significant E/H difference between (Cu,Ni) 6 Sn 5 (18.45) and (Ni,Cu) 3 Sn 4 (32.17) caused discontinuity in IMC mechanical behavior, thereby giving rise to cracking in-between those two phases and inferior impact resistance.…”

“…Numerous studies have been devoted to the mechanical behavior of IMCs in solder joints. Effects of alloying, growth texture, allotropic transition, crystal structure and compositions of IMCS were well studied [7,[9][10][11][12][13]. However, the relationships between IMC mechanical properties and solder joint reliability have not been systematically investigated yet.…”

“…However, the relationships between IMC mechanical properties and solder joint reliability have not been systematically investigated yet. Our previous reports suggested that the plastic ability can be evaluated by ratio of elastic modulus/hardness (E/H) [9,11,12]. High E/H indicates better plastic ability for IMCs, while low E/H implies brittleness.…”

A DFT Characterization of Structural, Mechanical, and Thermodynamic Properties of Ag9In4 Binary Intermetallic Compound

“…During the solder joint fabrication process, the Ag-based UBM tends to readily dissolve in the In-based solder, eventually bringing about the formation of a very thin Ag 9 In 4 intermetallic compound (IMC) layer [12]. Song et al [13] investigated the phase evolution of Ag-In phase IMCs that are obtained from isothermal reactions between In and Ag substrate metal. They indicated that the first emerging IMC phase was AgIn 2 , but it eventually and completely turned into Ag 9 In 4 after heating for 30 min at 180 • C. As a result, Ag 9 In 4 is the primary IMC phase among the Ag-In phase IMCs [13][14][15].…”