Nanomaterials: Laser‐Induced Nano/Microfabrications

Investigations on laser printing of microcapacitors using poly (methyl methacrylate) dielectric thin films for organic electronics applications

“…~1500 nm, the pixels (~350 µm lateral size) cannot be cut and/or removed from the donor, regardless of the laser fluence that is used. Between 100 and 300 mJ·cm -2 , the laser energy is absorbed by the DRL film which is decomposed into gaseous products, creating high pressure [3]. By further increasing the laser fluence, the bottom metal electrode is vaporized and the PMMA film explodes to finally render volcano-like structures, as presented in Figure 3a.…”

“…The Ag/PMMA donor substrates were also produced on quartz substrates, as follows. First, a DRL of triazene polymer was spincoated [3]. As top electrode, the substrates were covered with a 300 nm film of silver (Ag) by thermal evaporation (BOC Edwards AUTO306).…”

“…laser-induced forward transfer (LIFT), has been thoroughly investigated and presented in literature as an excellent spatially resolved printing method for organic and inorganic materials, in solid or liquid form [3]. Cutting and printing can be done by direct irradiation, with the use of an additional protecting layer made of a metal [3,[4][5][6][7], a polymeric sacrificial film [3,[8][9][10][11], i.e. a dynamic release layer (DRL) [3,8,12,13], or by using a specially designed printing system, i.e.…”

“…Cutting and printing can be done by direct irradiation, with the use of an additional protecting layer made of a metal [3,[4][5][6][7], a polymeric sacrificial film [3,[8][9][10][11], i.e. a dynamic release layer (DRL) [3,8,12,13], or by using a specially designed printing system, i.e. smart beam shaping (SBS) technique [14][15][16], liquid-crystal spatial light modulators (SLM) or digital micromirror devices (DMD) [17][18][19].…”

[INVITED] Laser-induced forward transfer: A high resolution additive manufacturing technology

“…Several presentations of this technique [2][3][4] are available in the literature and the following description of the LIFT principle is limited to the basic characteristics of the process. As shown in Fig.…”