Nanoindentation study of sputtered nanocrystalline iron thin films

Savader, J.B.; Scanlon, M. R.; Cammarata, R. C.; Smith, Deane K.; Hayzelden, C.

doi:10.1016/s1359-6462(96)00349-1

Cited by 25 publications

(11 citation statements)

References 17 publications

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“…According to Tymiak et al (2000), a yield stress vs grain size dependence relation obtained from nanoindentation tests showed that the yield stress increases with the decrease of grain size for ductile Cu nanocomponent. A similar relationship had been observed for several nanostructured materials, e.g., Savader et al (1997). Studies such as Espinosa et al (2004) and Florando and Nix (2005) demonstrated that a thinner film has a higher yield stress, and the yield stress of submicron-thick Cu films may reach 300-600 MPa, which is about one order of magnitude higher than that of bulk Cu (70 MPa; American Society for Metals 1975).…”

Section: Verification Of the Czm Parameterssupporting

confidence: 65%

Reinvestigation of the effect of plasticity on delamination process of Si/Cu interface in a ductile nano-cantilever

et al. 2009

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Previous experimental investigations (Hirakata et al. Int J Fract 145:261-271, 2007) have demonstrated that Si/Cu/SiN/Pt/C nano-cantilever is delaminated along the interface between Cu and Si layers when subjected to monotonically bending load, and the measured load-displacement relationship shows a nonlinear behavior. Based on the continuum mechanics model, this study carries out numerical simulations on the crack nucleation and propagation along the Si/Cu interface in order to clarify the effect of plasticity on the fracture behavior of the ductile nano-component. Exponential type of cohesive zone model (CZM) combined with finite element method was adopted to characterize the constitutive relationship of the Si/Cu interface. Two sets of simulations are performed, i.e., Cu layer obeys either linear elastic or Ramberg-Osgood elasto-plastic constitutive relation. The characteristic parameters of interfacial adhesion are extracted through calibration via experimental results. The simulation results indicate that (i) cohesive strength and work of separation are the dominating CZM parameters, and the exponential CZM is suitable for describing the interfacial delamination between the Cu and Si film layers; (ii) the Cu film layer in this nano-cantilever more favorably obeys a linear elastic constitutive relation; (iii) comparing to bulk Cu, nano-scale Cu has a much higher yield stress and hardening rate, which leads to little plastic deformation of the nano-cantilever specimen during the entire delamination process. The numerical predictions are in good agreement with the experimental results, wherein brittle fracture occurred during the Si/Cu interfacial delamination. And the nonlinear load-displacement behavior observed by the tests may be due to the cohesive law of the Si/Cu interface, instead of the plastic deformation of the Cu film layer.

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Section: Verification Of the Czm Parameterssupporting

confidence: 65%

Reinvestigation of the effect of plasticity on delamination process of Si/Cu interface in a ductile nano-cantilever

et al. 2009

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“…uli and/or hardnesses of sintered ceramics, metals, thin films, coatings and small volumes [6][7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Influence of low indentation load on Young's modulus and hardness of 4mol% Y2O3–ZrO2 by nanoindentation

Jang

2006

Journal of Alloys and Compounds

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“…This aspect was theoretically discussed by Christman 23 who showed the exponents of the equations to be crystal structure dependent, and different from 0.5. Experimental work of Savader et al 24 has shown an inverse grain size dependence of the hardness in the nanocrystalline iron films. Consequently, the Hall-Petch behavior is not necessarily the only way for the description and understanding of plastic deformation in nanocrystalline materials.…”

Section: Introductionmentioning

confidence: 96%

Plastic deformation in impure nanocrystalline ceramics

Chaim

1999

J. Mater. Res.

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Plastic deformation behavior of impure nanocrystalline ceramics (NCC) was modeled using the percolative composite model in conjunction with models for plastic deformation by grain boundary sliding. The "glass transition temperature" concept was used to determine the threshold strain rate criterion below which the impure nanocrystalline ceramic would deform plastically. Threshold strain rate is stress independent. It increases with the temperature increase and with the grain size decrease. Using the dissolution-precipitation model, dependence of the strain rate on temperature, stress, and grain size in the nanometer regime for impure NCCs was calculated. As an example, the critical conditions for plasticity in impure yttria-tetragonal zirconia polycrystals (Y-TZP) were evaluated. At 600 ± C, strain rates as high as 10 24 s 21 were expected in 10 nm impure Y-TZP. Comparison of the published data extrapolated into the nanometer range to the calculated threshold level showed that increase in the applied stress is associated with increase in the grain size and strain rate onsets for plastic deformation.

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Nanoindentation study of sputtered nanocrystalline iron thin films

Cited by 25 publications

References 17 publications

Reinvestigation of the effect of plasticity on delamination process of Si/Cu interface in a ductile nano-cantilever

Reinvestigation of the effect of plasticity on delamination process of Si/Cu interface in a ductile nano-cantilever

Influence of low indentation load on Young's modulus and hardness of 4mol% Y2O3–ZrO2 by nanoindentation

Plastic deformation in impure nanocrystalline ceramics

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