Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Indentation creep of an Fe-based bulk metallic glass

“…The magnitude of the creep displacement increases with the loading rates. Similar observation has been reported on Ce-based [15], and Pd-based [16] amorphous alloys, as well as in some crystalline materials [17,18]. The reason for the observed loading rate dependence remains unknown to us.…”

Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds

“…The pile-up feature 31 is clearly observable, in particular for Ni 3 Sn 4 . Though not strongly evidenced, from microstructural observations, 17 the larger pile-up of Ni 3 Sn 4 after undergoing scratching may be attributed to its looser grain structures than those of the Sn-Cu IMCs. As depicted in Fig.…”

“…For the three IMCs, the average hardness reported by Yang et al, 17 based on nanoindentation, was adopted: 6.45 GPa for Cu 6 Sn 5 , 6.34 GPa for Cu 3 Sn, and 6.33 GPa for Ni 3 Sn 4 . The hardness was similar among the three IMCs.…”

“…7,8 Because of the irregular shapes and micrometer scales of these IMCs in a solder joint, their mechanical properties are difficult to obtain by conventional test methods for bulk materials. The nanoindentation technique, [9][10][11][12][13][14][15][16][17] on the other hand, has been shown to be capable of capturing feasible YoungÕs moduli and hardnesses of these IMCs. [18][19][20] Our intention in our work here was to investigate further the nanotribological behaviors of Cu 6 Sn 5 , Cu 3 Sn, and Ni 3 Sn 4 binary IMCs, following the nanoscratch technique.…”

“…Following the procedure proposed by Yang et al,17 Cu 6 Sn 5 , Cu 3 Sn, and Ni 3 Sn 4 IMCs were developed by the annealing of Sn-Cu and Sn-Ni diffusion couples. Cross-sectional microstructures of the IMCs are shown inFig.…”