Abstract:The continuous effort of modern electronic industry is the miniaturization of microelectronic components. In order to guarantee the reliability of the joining process, the quantitative knowledge of the solder material properties is very important, especially the values of Young's modulus, Nanoindentation hardness and yield stress. However, small‐sized microelectronic devices require the fabrication of small sized specimens and the use of corresponding miniature material tests. At the Technische Universität Ber… Show more
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