Nanoimprint Lithography for Hybrid Plastic Electronics

McAlpine, Michael C.; Friedman, Robin S.; Lieber, Charles M.

doi:10.1021/nl034031e

Cited by 153 publications

(103 citation statements)

References 18 publications

(22 reference statements)

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“…Although NIL-based approaches have proven excellent resolutions, there are still significant challenges in meeting the stringent requirements of semiconductor IC manufacturing, especially in terms of defect control and production-level throughput, which requires printing 60-80 wafers per hour with extremely high yields. On the other hand, because of its simplicity this technique has found numerous applications in electronics (e.g., hybrid plastic electronics, [17] organic electronics and photonics, [18,19] nanoelectronic devices in Si [20,21] and in GaAs [22] ), in photonics (e.g., organic lasers, [23] conjugated [24] and nonlinear optical polymer nanostructures, [25] highresolution organic light-emitting diode (OLED) pixels, [26,27] diffractive optical elements, [28] broadband polarizers [29][30][31] ), in magnetic devices (e.g., single-domain magnetic structures, [32,33] high-density patterned magnetic media and highcapacity disks, [34,35,36] ), in nanoscale control of polymer crystallization, [37] and in biological applications (e.g., manipulating…”

Section: Introductionmentioning

confidence: 99%

Nanoimprint Lithography: Methods and Material Requirements

2007

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Nanoimprint lithography (NIL) is a nonconventional lithographic technique for high‐throughput patterning of polymer nanostructures at great precision and at low costs. Unlike traditional lithographic approaches, which achieve pattern definition through the use of photons or electrons to modify the chemical and physical properties of the resist, NIL relies on direct mechanical deformation of the resist material and can therefore achieve resolutions beyond the limitations set by light diffraction or beam scattering that are encountered in conventional techniques. This Review covers the basic principles of nanoimprinting, with an emphasis on the requirements on materials for the imprinting mold, surface properties, and resist materials for successful and reliable nanostructure replication.

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Section: Introductionmentioning

confidence: 99%

Nanoimprint Lithography: Methods and Material Requirements

2007

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“…Research in this field includes composites of metal in PDMS with optical functions, [21] conductive PDMS-carbon nanotube composites, [22,23] substrates for surface-enhanced Raman spectroscopy, [24,25] spherically curved metal oxide semiconductor field-effect transistors, [26] and flexible gold-polymer nanocomposites as passive components. [27,28] In addition to materials with electrical functionality on curved or bendable surfaces, some groups have demonstrated stretchable electronics by patterning stiff materials on compliant polymer surfaces. The stiff interconnects include silicon wires fabricated by Khang et al [29] and arrays of gold lines by Lacour et al [30] that can withstand up to 12 % strain.…”

mentioning

confidence: 99%

Microsolidics: Fabrication of Three‐Dimensional Metallic Microstructures in Poly(dimethylsiloxane)

et al. 2007

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This Communication describes a method of fabricating complex metallic microstructures in 3D by injecting liquid solder into microfluidic channels, and allowing the solder to cool and solidify; after fabrication, the metallic structures can be flexed, bent, or twisted. This method of fabrication-which we call microsolidics-takes advantage of the techniques that were developed for fabricating microfluidic channels in poly(dimethylsiloxane) (PDMS) in 2D and 3D, uses surface chemistry to control the interfacial free energy of the metal-PDMS interface, and uses techniques based on microfluidics, but ultimately generates solid metal structures. This approach makes it possible to build flexible electronic circuits or connections between circuits, complex embedded or freestanding 3D metal microstructures, 3D electronic components, and hybrid electronic-microfluidic devices.There are several techniques for making metal microstructures in 3D. Electroplating and electroless deposition are routinely used to construct microstructures with metallic layers several nanometers to several microns thick in 2D or 3D. [1][2][3][4][5][6][7][8][9][10][11] To generate solid replicas of 3D objects, several groups have developed a technique, referred to as "microcasting", to form metals in order to fabricate microparts (e.g., posts and gears) with features as small as 10 lm and aspect ratios as high as 10 from steel, zirconia, and alumina. [12,13] Techniques based on LIGA (Lithographie, Galvanoformung, und Abformung) produce even more complicated metallic objects by depositing a metal onto a molded polymer template that is subsequently removed to yield an open structure (such as a honeycomb arrangement of cells). [14,15] In principle, these approaches can be used to pattern metals of any thickness to produce features with an aspect ratio that is larger than that produced using electroplating. Solder reflow is a standard technique in electronic packaging, [16,17] and has recently been combined with micromolding in channels to form custom-made solder pieces for batches of chips.[18] The technique has also been used to form 3D connections (e.g., bridging opposite sides of an electronic circuit board or substrate): Lauffer and co-workers and Ference and co-workers describe similar approaches to bridge electrical "islands" of metal by heating solid rods of solder "on chip"-the solder flows along trenches, holes, or metal strips (formed lithographically) and produces electrically conductive wires between the top and bottom surfaces of the substrate. [19,20] A growing interest in flexible sensors and displays has fueled the development of polymer-metal composites. Research in this field includes composites of metal in PDMS with optical functions, [21] conductive PDMS-carbon nanotube composites, [22,23] substrates for surface-enhanced Raman spectroscopy, [24,25] spherically curved metal oxide semiconductor field-effect transistors, [26] and flexible gold-polymer nanocomposites as passive components. [27,28] In addition to materials with electrica...

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“…5) [90][91][92][93][94][95][96][97][98][99][100]. The suspended NWs move in the flow direction and align along the direction of shear force.…”

Section: Assembly By Shear Forces In a Fluidmentioning

confidence: 99%

Recent Advances in Directed Assembly of Nanowires or Nanotubes

Liu

Lau

et al. 2012

Nano-Micro Lett.

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Nanowires and nanotubes of diverse material compositions, properties and/or functions have been produced or fabricated through various bottom-up or top-down approaches. These nanowires or nanotubes have also been utilized as potential building blocks for functional nanodevices. The key for the integration of those nanowire or nanotube based devices is to assemble these one dimensional nanomaterials to specific locations using techniques that are highly controllable and scalable. Ideally such techniques should enable assembly of highly uniform nanowire/nanotube arrays with precise control of density, location, dimension or even material type of nanowire/nanotube. Numerous assembly techniques are being developed that can quickly align and assemble large quantities of one type or multiple types of nanowires through parallel processes, including flow-assisted alignment, Langmuir-Blodgett assembly, bubble-blown technique, electric/magnetic-field directed assembly, contact/roll printing, knocking-down, etc.. With these assembling techniques, applications of nanowire/nanotube based devices such as flexible electronics and sensors have been demonstrated. This paper delivers an overall review of directed nanowire assembling approaches and analyzes advantages and limitations of each method. The future research directions have also been discussed.

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Nanoimprint Lithography for Hybrid Plastic Electronics

Cited by 153 publications

References 18 publications

Nanoimprint Lithography: Methods and Material Requirements

Nanoimprint Lithography: Methods and Material Requirements

Microsolidics: Fabrication of Three‐Dimensional Metallic Microstructures in Poly(dimethylsiloxane)

Recent Advances in Directed Assembly of Nanowires or Nanotubes

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