This study highlights the thermal properties of nano-dielectrics materials composed of epoxy resin host and Graphene nano-platelets (GnP) have been studied. The introduction of the GnP nano-platelets (0.5, 1, 2, 3 and 5wt %) into the epoxy resin by the three roll mill technique following the Caframo mechanical mixer method is described. Asilane Coupling Agent (SCA) was used for the surface modification for better dispersion of filler in organic polymer matrix and for better compatibility between nano-platelets and host material. Thermal conductivity, glass transition temperature and thermal stability of nano-dielectrics were investigated based on the filler content. The synergistic effect was observed due to the introduction of GnP. The high-k nano-dielectric materials show better thermal conductivity and stability than that of the pure epoxy resins. The best performance of the composite is observed with 3wt% of graphene nano-platelets.