Nano-Underfills for High-Reliability Applications in Extreme Environments

Lall, Pradeep; Islam, Saiful; Suhling, Jeff; Tian, Guoyun

doi:10.1109/ectc.2005.1441269

Cited by 14 publications

(1 citation statement)

References 17 publications

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“…Lifetime simulation relies on profound knowledge of material and failure behavior and accuracy of the failure models. Research on such models for CMOS, nanotubes, and other important nano-devices has been reported [5,6,7,8,9,10].…”

Section: Research On Nano-scale Cmos Reliabilitymentioning

confidence: 99%

Failure Mechanisms and Lifetime Simulation Method for Nano Scale CMOS Device

Cheng

Kang

Zhang

2011

KEM

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In nano scale, the degradation failure mechanism for CMOS device such as hot-carrier injection, breakdown of thin oxides, electro-migration and NBTI (Negative Bias Temperature Instability) induced damage become a major reliability concern. Physics-of-Failure method is used in lifetime prediction of nano scale CMOS, which integrates loading condition, package, geometry and material with time-to-failure. Common lifetime models for these mechanisms are described and a method to estimate lifetime of nano-scale CMOS device, with simulation based on Physics-of-Failure. Through Failure Mode, Mechanism and Effect Analysis, failure mechanism and lifetime models are clarified and selected, as well as structure, material, processing parameters and environment conditions. Stress analysis, which includes electrical stress by EDA and thermal analysis by FEA (Finite Element Analysis) are carried out to acquire parameters in lifetime model. Damage accumulation algorism and competing theory are utilized to predict lifetime of the device. This method will help CMOS device design engineers better understand the failure mechanisms in nano-scale and take design-for-reliability measures.

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Section: Research On Nano-scale Cmos Reliabilitymentioning

confidence: 99%

Failure Mechanisms and Lifetime Simulation Method for Nano Scale CMOS Device

Cheng

Kang

Zhang

2011

KEM

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Nanomaterials and Nanopackaging

Wang

Wang²,

Jiang³

et al. 2009

Materials for Advanced Packaging

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Nanopackaging: Nanotechnologies and Electronics Packaging

Morris

2018

Nanopackaging

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Nano-Underfills for High-Reliability Applications in Extreme Environments

Cited by 14 publications

References 17 publications

Failure Mechanisms and Lifetime Simulation Method for Nano Scale CMOS Device

Failure Mechanisms and Lifetime Simulation Method for Nano Scale CMOS Device

Nanomaterials and Nanopackaging

Nanopackaging: Nanotechnologies and Electronics Packaging

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