1998
DOI: 10.1016/s0167-9317(98)00076-8
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Nano-patterning of a hydrogen silsesquioxane resist with reduced linewidth fluctuations

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Cited by 156 publications
(82 citation statements)
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“…10 Isolated polymers will cross-link during thermal or radiation treatment which results in an increase in the ratio of Si-O to Si-H bonds. 11 To create a lithographic pattern, unexposed regions of HSQ are dissolved away in either aqueous base solutions 12 or a variety of organic solvents, 13 leaving a patterned film on the substrate.…”
Section: Introductionmentioning
confidence: 99%
“…10 Isolated polymers will cross-link during thermal or radiation treatment which results in an increase in the ratio of Si-O to Si-H bonds. 11 To create a lithographic pattern, unexposed regions of HSQ are dissolved away in either aqueous base solutions 12 or a variety of organic solvents, 13 leaving a patterned film on the substrate.…”
Section: Introductionmentioning
confidence: 99%
“…In order to verify the possibility to localize single nanocrystals by means of electron beam lithography, a dielectric structure, consisting of a SiO 2 /TiO 2 -based distributed Bragg reflector (DBR) and an additional SiO 2 spacing layer, has been preliminary fabricated. A very low concentration of CdSe/ZnS colloidal nanocrystals emitting at = 610 nm has been dispersed in a high-resolution electron-beam resist, namely Hydrogen Silsesquioxane (HSQ) (Namatsu et al, 1998). A 90 nm thick layer of the blend has been spin-coated on the dielectric structure and subsequently exposed to the electron beam to define an array of active pillars with diameters ranging from 500 nm down to 30 nm.…”
Section: Advances In Resist Materials and Processing Technology: Photmentioning
confidence: 99%
“…negative tone electron beam resist [4]. It is has been since shown to be a highly successful electron beam resist, capable of producing very high resolution patterns [5], with low line edge roughness [4].…”
Section: Journal Logomentioning
confidence: 99%
“…It is has been since shown to be a highly successful electron beam resist, capable of producing very high resolution patterns [5], with low line edge roughness [4]. The structure of the exposed material is similar to silicon dioxide and thus it has a high dry etch resistance and is mechanically stable.…”
Section: Journal Logomentioning
confidence: 99%