Nano-Cutting Molecular Dynamics Simulation of a Copper Single Crystal

Chen, Jiaxuan; Wang, Quanlong; Liang, Yingchun; Wang, Liquan; Zhang, Linqi; Shang, Yuanjiang

doi:10.1016/j.proeng.2012.01.515

Cited by 5 publications

(1 citation statement)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Kim [10] and Chen [11] studied the effects of different crystal orientations on the force of the workpiece during machining. The former shows that when monocrystalline copper is cut, the workpiece is subjected to the maximum force when machining occurs along the (111)…”

Section: Introductionmentioning

confidence: 99%

Effect of different crystal orientations on the surface integrity during nanogrinding of monocrystalline nickel

Ren¹,

Liang²,

Liu³

2019

Modelling Simul. Mater. Sci. Eng.

View full text Add to dashboard Cite

During nanofabrication, the processing of different crystal faces along the surface of a workpiece varies because of size effects. The burr height and subsurface damage during nanogrinding of different crystal orientations in monocrystalline nickel are simulated by molecular dynamics in this study. The burr height and depth of the subsurface deformation layer are calculated quantitatively by atomic displacement, common neighbor analysis and dislocation analysis techniques. Among the directions considered in this paper, the burr height is the smallest when grinding in the (110)[110] direction, and the depth of the subsurface deformation layer is small when grinding along the (111) plane. This study demonstrates the effect of different slip paths on burr height and provides a reference for the actual processing of face-centered cubic crystals.

show abstract

Section: Introductionmentioning

confidence: 99%