2016
DOI: 10.1109/ted.2016.2594027
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Nano-CNC Machining of Sub-THz Vacuum Electron Devices

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Cited by 94 publications
(21 citation statements)
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“…As the working frequency goes up to the Y-band, this processing error cannot satisfy the requirement of our new device. And hence, we try the UV-LIGA technique to fabricate the planar SWSs 21 . Since the electromagnetic losses increase dramatically at higher frequencies, the copper material is selected for its low millimeter wave loss and high thermal conductivity.…”
Section: Fabrication Of the Bwomentioning
confidence: 99%
“…As the working frequency goes up to the Y-band, this processing error cannot satisfy the requirement of our new device. And hence, we try the UV-LIGA technique to fabricate the planar SWSs 21 . Since the electromagnetic losses increase dramatically at higher frequencies, the copper material is selected for its low millimeter wave loss and high thermal conductivity.…”
Section: Fabrication Of the Bwomentioning
confidence: 99%
“…The DCW circuit is in fabrication phase by using the NN1000 DCG HSC nano-CNC milling machine developed by Digital Technology Laboratory, subsidiary of DMG -MORI, in Davis CA as a prototype machine for advancement of nano-precision manufacturing capabilities [9,10]. The DCW circuit is manufactured employing CNC milling technology to create the micro pillars as is shown in Fig.9 and the average surface roughness (Ra) across pillar surfaces is about 124 nm after copper bright dip cleaning.…”
Section: A Dcw Circuitmentioning
confidence: 99%
“…A machining tolerance with a few microns, a surface roughness with hundreds of nanometers and a small assembling error are typically required in the fabrication of the HFS in a terahertz band SB-TWT. Considerable efforts have been made for the fabrication of the micro-structures in a terahertz vacuum electron device, such as the nano-computer numerical control (CNC) milling techniques [3], [15], [24]- [25], LIGA (German acronym for lithography, electroplating, and molding) process techniques [13], [26], deep-reactive ion etching (DRIE) techniques [26], wire cutting techniques [10], [27], and the 3D-printed mold electroforming [28].…”
Section: Introductionmentioning
confidence: 99%