Nano‐antennae assisted emission of extreme ultraviolet radiation

Abstract

High-order harmonic generation in xenon with oscillator repetition rates is studied. The necessary intensity is reached via plasmonic field enhancement at nanostructured arrays of bow-tie gold antennae. The theoretical analysis focuses on the thermal properties and the damage threshold of the bow-tie antennae. On the experimental side the number of contributing atoms is determined and optimized. Extreme ultraviolet radiation is successfully observed with photon fluxes almost an order of magnitude larger than previously reported.

Controlling polarization of attosecond pulses with plasmonic-enhanced bichromatic counter-rotating circularly polarized fields

“…Since the experiment of Kim et al [35], a number of works have investigated the plasmonic-field assisted HHG using structured nano-objects [36][37][38][39][40][41][42][43][44]. Moreover, different kinds of nanostructures such as metal nanotips [42,43], metallic waveguides [36], nanoparticles [45] and plasmonic antennas [40], have been explored, while many more works tried to explain HHG mediated by a plasmonic-enhanced field using numerical and theoretical methods [46][47][48][49][50][51][52][53][54][55][56][57][58][59][60][61][62].…”

Simultaneous control of harmonic yield and energy cutoff of high-order harmonic generation using seeded plasmonically enhanced fields

“…have motivated a truly deluge of experimental and theoretical investigations on HHG driven by plasmonic field enhancement in structured nano-objects [20][21][22][26][27][28][29][30][31].…”

Flat Optical and Plasmonic Devices Using Area‐Selective Ion‐Beam Doping of Silicon

“…However, in the mid to far infrared (IR), noble metals are not always ideal plasmonic materials because their optical properties closely resemble those of a perfect electric conductor and cannot be easily modified . In addition, many plasmonic devices are not monolithic (e.g., metallic antennas on a dielectric substrate), making them susceptible to thermal and physical damage . Furthermore, metals such as gold and silver are considered contaminants for silicon‐based electronic devices, and can therefore be difficult to integrate into complimentary metal–oxide–semiconductor (CMOS) and other on‐chip architectures .…”